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特定类型绕组导线规范 第20部分：可焊接聚氨酯涂覆圆形铜线 耐温等级155（IEC 60317-20:2000, MOD）

Specifications for certain types of winding conductors Part 20: Weldable polyurethane-coated round copper wires, temperature class 155 (IEC 60317-20:2000, MOD)

环境试验．试验．T试验导则：焊接

Environmental testing - Tests - Guidance on test T: Soldering

环境试验．试验．Ta试验：湿润天平法焊接试验

Environmental testing - Tests - Test Ta: Soldering - Solderability testing by the wetting balance method

环境试验．试验．Td试验：可焊性，敷金属耐受性能以及表面安装美利体育官网首页网址（SMD）的焊接热耐受性能的试验方法

Environmental testing - Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

混凝土加固用变形和普通低合金钢筋的标准规范

Standard Specification for Deformed and Plain Low-Alloy Steel Bars for Concrete Reinforcement

金属涂层产品可焊性的标准测试方法

Standard Test Method for Solderability of Metallic-Coated Products

金属镀层产品可焊性标准试验方法

Standard Test Method for Solderability of Metallic-Coated Products

旨在用于可焊性电气和电子应用的高性能镀锡软铜线的标准规格

Standard Specification for High Performance Tin-Coated Annealed Copper Wire Intended for Electrical and Electronic Application for Solderability

用于电气和电子应用可焊性的高性能镀锡退火铜丝的标准规范

Standard Specification for High Performance Tin-Coated Annealed Copper Wire Intended for Electrical and Electronic Application for Solderability

用于电气和电子应用可焊性的高性能镀锡退火铜丝的标准规范

Standard Specification for High Performance Tin-Coated Annealed Copper Wire Intended for Electrical and Electronic Application for Solderability

现有建筑的加固和维修指南

Guide for Strengthening and Repairing Existing Structures

手工焊接实践指南

GUIDELINE FOR HAND SOLDERING PRACTICES

航空航天系列.航空航天结构用焊接及铜焊组件.材料的可焊接性和可铜焊接性.一般要求

Aerospace series - Welded and brazed assemblies for aerospace constructions - Weldability and brazeability of materials - General requirements

航空航天系列.航空航天结构用材料的可焊接性和可铜焊性.耐热Ni 或Co基合金的类似组件

Aerospace series - Weldability and brazeability of materials in aerospace constructions - Homogeneous assemblies of heat resisting Ni or Co base alloys

航空航天系列.航空航天结构用材料的可焊接性和可钎焊性.钛合金的均质装配件

Aerospace series. Weldability and brazeability of materials in aerospace constructions. Homogeneous assemblies of titanium alloys

环境试验.试验.试验Ta:使用润湿平衡法对电子部件进行软焊性测试

Environmental testing - Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

环境试验.试验.试验Td.表面安装美利体育官网首页网址(SMD)的可焊性,耐金属化溶融和耐焊接热试验方法

Environmental testing - Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

环境测试.试验.试验Te:用润湿平衡法对表面安装美利体育官网首页网址(SMD)电子元件的软钎焊性试验

Environmental testing - Tests - Test Te - Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

环境美利体育登录入口官网.美利体育登录入口官网.美利体育登录入口官网Tf:使用焊锡膏润湿平衡法对表面安装器具(SMD)进行电子元件的焊锡性试验

Environmental testing. Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

电子美利体育官网首页网址连接器.试验和测量.焊接试验.试验12a.金属熔化浴法测量可焊性

Connectors for electronic equipment - Tests and measurements - Soldering tests - Test 12a - Solderability, wetting, solder bath method

电子美利体育官网首页网址连接器.试验和测量.锡焊试验.湿可焊性

Connectors for electronic equipment - Tests and measurements - Soldering tests - Solderability, de-wetting

半导体装置.机械和气候耐受性试验方法.可焊性

Semiconductor devices. Mechanical and climatic test methods. Solderability

环境测试 测试 测试 Ta 和 Tb：带引线器件的可焊性和耐焊热性的测试方法

Environmental testing. Tests. Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads

同轴通信电缆 第 1-305 部分：机械测试方法 - 可焊性和耐焊接性

Coaxial communication cables - Part 1-305: Mechanical test methods - Solderability and resistance to soldering

印制电路板可焊性测定 边浸法

Determination of Solderability of Printed Circuit Boards by Edge Dip Method

欧姆环境试验 裸装表面贴装器件（SMD）在无铅焊料焊接过程中的可焊性和抗焊热性测试方法

Ohmic environmental test - Test method for solderability and resistance to soldering heat of bare surface mount devices (SMD) during lead-free soldering

电镀涂层 铁和铜材料上的锡涂层

Electroplated coatings - Tin-coatings on iron- and copper-materials

电镀涂层 铁和铜材料上的锡涂层

Electroplated coatings - Tin-coatings on iron- and copper-materials

可铜焊性、可软钎焊性

Brazeability, solderability

钎焊性, 可焊性

Brazeability, solderability

航空航天系列.光电连接元件.试验方法.第501部分:软钎焊性

Aerospace series - Elements of electrical and optical connection; Test methods - Part 501: Soft solderability; German and English version EN 2591-501:2002

航空航天系列.光电连接元件.试验方法.第514部分:自含焊锡和助熔剂的触点可焊性

Aerospace series - Elements of electrical and optical connection; Test methods - Part 514: Solderability of contacts with self-contained solder and flux; German and English version EN 2591-514:2002

航空航天系列-电气和光学连接元件

Aerospace series - Elements of electrical and optical connection; Test methods - Part 514: Solderability of contacts with self-contained solder and flux; German and English version EN 2591-514:2002

航空航天系列.航空用电缆.试验方法.第509部分:可焊性; 德文和英文版本 EN 3475-509:2002

Aerospace series - Cables, electrical, aircraft use; Test methods - Part 509: Solderability; German and English version EN 3475-509:2002

航空航天系列.航空航天结构用焊接及铜焊组件.材料的可焊接性和可铜焊接性.第003部分:非合金和低合金钢均质装配的焊接和钎焊.德文和英文版本EN 4632-003-2010

Aerospace series - Weldability and brazeability of materials in aerospace constructions - Part 003: Welding and brazing of homogeneous assemblies of unalloyed and low alloy steels; German and English version EN 4632-003:2010

航空航天系列-航空航天结构材料的可焊性和钎焊性-第003部分：非合金钢和低合金钢均质组件的焊接和钎焊

Aerospace series - Weldability and brazeability of materials in aerospace constructions - Part 003: Welding and brazing of homogeneous assemblies of unalloyed and low alloy steels; German and English version EN 4632-003:2010

航空航天系列.航空航天结构用焊接及铜焊组件.材料的可焊接性和可铜焊接性.第005部分:耐热镍基或钴基合金均匀组件.德文和英文版本EN 4632-005-2009

Aerospace series - Weldability and brazeability of materials in aerospace constructions - Part 005: Homogeneous assemblies of heat resisting Ni or Co base alloys; German and English version EN 4632-005:2009

航空航天系列-航空航天结构材料的可焊性和钎焊性-第005部分：耐热镍基或钴基合金的均质组件

Aerospace series - Weldability and brazeability of materials in aerospace constructions - Part 005: Homogeneous assemblies of heat resisting Ni or Co base alloys; German and English version EN 4632-005:2009

航空航天系列-航空航天结构用焊接和钎焊组件-电子束焊接金属材料接头-第001部分：焊接组件的质量

Aerospace series - Welded and brazed assemblies for aerospace construction - Joints of metallic materials by electron beam welding - Part 001: Quality of welded assemblies; German and English version EN 4677-001:2012 / Note: To be replaced by DIN EN 46...

环境试验.第2-20部分:试验.试验T:带导线装置的可焊接性和焊接热抵抗性的试验方法

Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads (IEC 60068-2-20:2008); German version EN 60068-2-20:2008

环境试验.第2-54部分:试验.试验Ta:通过润湿平衡法进行电子元件的软焊性试验

Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method (IEC 60068-2-54:2006); German version EN 60068-2-54:2006

环境试验 第2-58部分：试验 试验Td：表面安装美利体育官网首页网址 (SMD) 的可焊性、耐金属化溶融和耐焊接热的试验方法（草案）

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

环境试验.第2-58部分:试验.试验Td:表面安装美利体育官网首页网址(SMD)的可焊性、耐金属化溶融和耐焊接热的试验方法

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2004); German version EN 60068-2-58:2004 + Corrigendum 2

环境测试 第2-83部分：测试 测试 Tf：使用焊膏通过润湿平衡法对表面安装器件(SMD)的电子元件进行可焊性测试

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste (IEC 60068-2-83:2011); German version EN 60068-2-83:2011

环境测试 第3-13部分：测试T焊接的支持文件和指南（草案）

Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering

环境测试.第3-13部分:测试T焊接的支持文件和指南(IEC 60068-3-13-2016);德文版本EN 60068-3-13-2016

Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering (IEC 60068-3-13:2016); German version EN 60068-3-13:2016

环境测试

Environmental testing

电子美利体育官网首页网址用连接器.试验和测量.第12-1部分:焊接试验.试验12a:焊料湿浴法测量可焊性(IEC 60512-12-1:2006)

Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method (IEC 60512-12-1:2006); German version EN 60512-12-1:2006

电子美利体育官网首页网址连接器 测试和测量 第12-1部分：焊接测试 测试 12a：可焊性、润湿性、焊浴方法

Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method (IEC 60512-12-1:2006); German version EN 60512-12-1:2006

电子美利体育官网首页网址用连接器.试验和测量.第12-2部分:钎焊试验.试验12b:铁钎焊法测量湿可焊性(IEC 60512-12-2:2006)

Connectors for electronic equipment - Tests and measurements - Part 12-2: Soldering tests - Test 12b: Solderability, wetting, soldering iron method (IEC 60512-12-2:2006); German version EN 60512-12-2:2006

电子美利体育官网首页网址连接器 测试和测量 第12-2部分：焊接测试 测试 12b：可焊性、润湿性、烙铁方法

Connectors for electronic equipment - Tests and measurements - Part 12-2: Soldering tests - Test 12b: Solderability, wetting, soldering iron method (IEC 60512-12-2:2006); German version EN 60512-12-2:2006

电子美利体育官网首页网址用连接器.试验和测量.第12-3部分:钎焊试验.试验12c:除湿可焊性(IEC 60512-12-3:2006)

Connectors for electronic equipment - Tests and measurements - Part 12-3: Soldering tests - Test 12c: Solderability, de-wetting (IEC 60512-12-3:2006); German version EN 60512-12-3:2006

电子美利体育官网首页网址连接器.试验和测量.第12-7部分:焊接试验.试验12g.可焊性.湿润平衡法

Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests; Test 12g: Solderability, wetting balance method (IEC 60512-12-7:2001); German version EN 60512-12-7:2001

电子美利体育官网首页网址连接器 测试和测量 第12-7部分：焊接测试

Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests; Test 12g: Solderability, wetting balance method (IEC 60512-12-7:2001); German version EN 60512-12-7:2001

半导体美利体育官网首页网址.机械和气候试验方法.第21部分:可焊性(IEC 60749-21-2011).德文版 EN 60749-21-2011

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 60749-21:2011); German version EN 60749-21:2011

半导体器件 机械和气候测试方法 第21部分：可焊性

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 60749-21:2011); German version EN 60749-21:2011 / Note: DIN EN 60749-21 (2005-06) remains valid alongside this standard until 2014-05-12.

绕组线.试验方法.第4部分:化学性能

Winding wires - Test methods - Part 4: Chemical properties (IEC 60851-4:1996 + A1:1997 + A2:2005); German version EN 60851-4:1996 + A1:1997 + A2:2005

绕组线 测试方法 第4部分：化学性能

Winding wires - Test methods - Part 4: Chemical properties (IEC 60851-4:2016); German version EN 60851-4:2016 / Note: DIN EN 60851-4 (2005-11) remains valid alongside this standard until 2019-08-10.

表面安装技术.第1部分:表面安装元器件(SMDS)规范的标准方法(IEC 61760-1-2006)

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 61760-1:2006); German version EN 61760-1:2006

电阻焊 可焊接性 第1部分：金属材料电阻点焊, 缝焊和凸焊可焊接性的通用要求（草案）

Resistance welding weldability Part 1: General requirements for the weldability of metallic materials for resistance spot welding, seam welding and projection welding (draft)

组件引脚、终端、接线柱、端子和导线的可焊接性测试

Solderability testing of component pins, terminals, posts, terminals and wires

微电子技术用贵金属浆料规范

Specification for pastes of precious metal used for microelectronics

电工电子产品环境试验 第2部分;试验方法 试验T:锡焊

Environmental testing for electric and electronic products.Part2:Test methods-Test T:Soldering

电工电子产品环境试验.第2部分：试验方法.试验Ta: 润湿称量法可焊性

Environmental testing for electric and electronic products.Part 2:Test methods.Test Ta:Solderability test by the wetting balance method

电工电子产品环境试验.第2部分:试验方法.试验T:锡焊试验导则

Environmental testing for electric and electronic products.Part 2:Test methods Guidance on test T:Soldering test

电子装联高质量内部互连用助焊剂

Soldering fluxes for high-quality interconnections in electronics assembly

电子美利体育官网首页网址用机电元件 基本试验规程及测量方法 第6部分;气候试验和锡焊试验

Electromechanical components for electronic equipment. Basic testing procedures and measuring methods. Part 6: Climatic tests and soldering tests

电子及电气元件试验方法

Test methods for electronic and electrical component parts

CCS410805型高可靠无引线片式1类多层瓷介固定电容器详细规范

Detail specification for fixed chip ceramic dielectric nonleaded class 1,type CCS410805 capacitors with high reliability

CTS412225型高可靠无引线片式2类多层瓷介固定电容器详细规范

Detail specification for fixed chip ceramic dielectric nonleaded class 2,type CTS412225 capacitors with high reliability

CCS407型高可靠有引线1类多层瓷介固定电容器详细规范

Detail specification for fixed ceramic dielectric leaded class 1,type CCS407 capacitors with high reliability

CTS411210型高可靠无引线片式2类多层瓷介固定电容器详细规范

Detail specification for fixed chip ceramic dielectric nonleaded class 2,type CTS411210 capacitors with high reliability

受外部因素影响的主要试验方法.第2部分.试验.试验Ta.钎焊.采用潮湿平衡法试验可焊性

Basic environmental testing procedures. Part 2. Tests. Test Ta: Soldering. Solderability testing by the wetting balance method

可焊性.定义

Weldability. Definition

环境试验. 第2-54部分. 试验Ta: 采用湿平衡法的电子元件焊接性试验

Environmental testing. Part 2-54. Test Ta: Solderability testing of electronic components by the wetting balance method

环境试验. 第2部分: 试验. 试验Ta和试验Tb: 带导线装置的可焊接性和焊接热抵抗性的试验方法

Environmental testing - Part 2-20: Tests - Tests Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads

环境试验第2-20部分:试验Ta和Tb试验:带引线器件的可焊性和耐焊接热的试验方法

Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads

环境试验.第2-54部分:试验.试验Ta:通过润湿平衡法的电子元件的软钎焊

Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

环境试验.第2-58部分:试验.试验Td:表面安装元器件(SMD)用可焊性、耐金属化溶融和耐焊接热的试验方法

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

环境试验第2-58部分:试验试验Td:表面安装器件（SMD）的可焊性、耐金属化物溶解性和耐焊接热的试验方法

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

环境试验.第2-58部分:试验.试验Td:表面安装元器件(SMD)用可焊性、耐金属化溶融和耐焊接热的试验方法

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

环境试验第2-69部分:试验Te/Tc:用润湿平衡（测力）法对电子元件和印制板进行可焊性试验

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

环境试验 第2-58部分：试验 试验Td

Environmental testing — Part 2-58: Tests — Test Td

特种绕组线规范 第0-3部分 一般要求 漆包圆铝线

Specifications for particular types of winding wires - Part 0-3: General requirements - Enamelled round aluminium wire

特种绕组线规范第23部分:180级可焊聚酯亚胺漆包圆铜线

Specifications for particular types of winding wires - Part 23: Solderable polyesterimide enamelled round copper wire, class 180

电子美利体育官网首页网址用连接器.试验和测量.第12-1部分:焊接试验.试验12a: 焊料湿浴法测量可焊性

Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method

电子美利体育官网首页网址用连接器.试验和测量.第12-2部分:钎焊试验.试验12b:铁钎焊法测量湿可焊性

Connectors for electronic equipment - Tests and measurements - Part 12-2: Soldering tests - Test 12b: Solderability, wetting, soldering iron method

电子美利体育官网首页网址用连接器 试验和测量 第12-7部分：锡焊试验 试验12g：可焊性、湿润平衡法

Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests; Test 12g: Solderability, wetting balance method

半导体器件.机械和气候试验方法.第21部分:可焊性

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

半导体器件 机械和气候试验方法 第21部分：可焊性

Semiconductor devices. Mechanical and climatic test methods. - Part 21: Solderability

半导体器件 机械和气候试验方法 第21部分：可焊性

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

半导体器件 机械和气候试验方法 第21部分：可焊性

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

绕组线试验方法第4部分:化学性能

Winding wires - Test methods - Part 4: Chemical properties

同轴通信电缆. 第1-305部分: 机械试验方法. 焊接性和耐焊接性

Coaxial communication cables - Part 1-305: Mechanical test methods - Solderability and resistance to soldering

同轴通信电缆 第1-305部分：机械试验方法 - 可焊性和耐焊接性

Coaxial communication cables Part 1-305: Mechanical test methods - Solderability and resistance to soldering

同轴通信电缆 第1-305部分：机械试验方法 可焊性和耐焊接性

Coaxial communication cables - Part 1-305: Mechanical test methods - Solderability and resistance to soldering

表面安装技术.第2部分:表面安装器件(SMD)的运输和存储条件.使用指南

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

印刷电路板沉浸镀锡规格

Specification for Immersion Tin Plating for Printed Circuit Boards

焊膏评估指南

Guide to Solder Paste Assessment

焊接的电气和电子组件要求

Requirements for Soldered Electrical and Electronic Assemblies

印刷电路板可焊性测试标准

IPC J-STD-003D Solderability Tests for Printed Boards

元器件引线、焊端、焊片、端子和导线的可焊性测试

Solderability testing of component leads, solder terminals, solder tabs, terminals and wires

印刷电路板可焊性测试标准

Solderability Tests for Printed Boards

电磁线圈用导线 试验方法 第4部分：化学性能 (IEC 60851-4:1997 修改版)

Winding wires. Test methods. Part 4 - Chemical properties. (IEC 60851-4:1997, MOD)

焊接.与焊接和相关工艺有关的车间底漆试验.第2部分：车间底漆的焊接性能

Welding - Test for shop primers in relation to welding and allied processes - Part 2: Welding properties of shop primers

阻焊.可焊性.第1部分:金属材料的电阻点焊、缝焊和凸焊的可焊性评定

Resistance welding — Weldability — Part 1: General requirements for the evaluation of weldability for resistance spot, seam and projection welding of metallic materials

电阻焊. 可焊接性. 第2部分: 电焊可焊接性的评估程序

Resistance welding - Weldability - Part 2: Evaluation procedures for weldability in spot welding

焊接设计规范

Design specifications for welding

可焊性

Solderability

特种绕组线规格. 第2部分: 130级带粘合层的可软焊聚氨酯漆包圆铜线

Specifications for particular types of winding wires -- Part 2: Solderable polyurethane enamelled round copper wire, class 130, with a bonding layer

环境试验.第2-20部分:试验.试验T:带导线装置的可焊接性和焊接热抵抗性的试验方法

Environmental testing -- Part 2-20: Tests -- Test T: Test methods for solderability and resistance to soldering heat of devices with leads

锡电镀层

Electroplated coatings of tin

航空航天系列 航空航天结构材料焊接性与钎焊性 第003部分：非合金钢和低合金钢均质组装件的焊接与钎焊

Aerospace series - Weldability and brazeability of materials in aerospace constructions - Part 003: Welding and brazing of homogeneous assemblies of unalloyed and low alloy steels

航空航天系列 航空航天构造中材料的可焊性和可钎焊性 第005部分：耐热镍或钴基合金的均质组件

Aerospace series - Weldability and brazeability of materials in aerospace constructions - Part 005: Homogeneous assemblies of heat resisting Ni or Co base alloys

航空航天系列 航空航天结构中材料的可焊性和可钎焊性 第006部分：钛合金均质组件

Aerospace series - Weldability and brazeability of materials in aerospace constructions - Part 006: Homogeneous assemblies of titanium alloys

环境影响试验 第2-58部分：试验 Td 试验 用于确定表面安装装置的可焊性、浸锡耐性和回流焊接耐热性的试验方法（IEC 60068-2-58:2015）

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2015)

环境影响试验 第2-69部分：试验 方法：Te/Tc试验 电子元件和印刷电路板可焊性试验 润湿天平（测力）法 (IEC 60068-2-69:2017)

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 60068-2-69:2017)

环境试验 第3-13部分：焊接测试 T 的支持文件和指导（IEC 60068-3-13:2016）

Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering (IEC 60068-3-13:2016)

半导体器件 机械和气候测试方法 第21部分：可焊性（IEC 60749-21:2011）

Semiconductor devices - Mechanical and climatic test methods -- Part 21: Solderability (IEC 60749-21:2011)

绕组导线 试验方法 第4部分：化学特性 (IEC 60851-4:2016)

Winding wires - Test methods - Part 4: Chemical properties (IEC 60851-4:2016)

混凝土用钢筋 可焊钢筋 棒材、卷材及开卷产品 规范（第四版）

Steel for the reinforcement of concrete - Weldable reinforcing steel - Bar, coil and decoiled product - Specification (Fourth revision)

压水堆核电厂用不锈钢.第19部分:1、2、 3 级马氏体不锈钢承压铸件

Stainless steel for pressurized water reactor nuclear power plants.Part 19: Class 1、2 and 3 pressure-retaining martensitic stainless steel castings

高性能电线和电缆应用中含锡镀镍绞线的焊锡性问题解决方案

Solderability Problem Solutions for Tin-Containing Nickel-Plated Stranded Wire in High-Performance Wire and Cable Applications

环境试验.第2-58部分:试验.试验Td.表面安装元器件(SMD)用可焊性、耐金属化溶融和耐焊接热试验方法

Environmental testing - Part 2-58 : tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD).

电镀，铜

Plating, Copper

钢 耐腐蚀耐热 焊丝 11.8Cr 2.8Ni 1.6Co 1.8Mo 0.32V 真空感应熔炼（UNS S41780）

Steel@ Corrosion and Heat Resistant@ Welding Wire 11.8Cr - 2.8Ni - 1.6Co - 1.8Mo - 0.32V Vacuum Induction Melted (UNS S41780)

RNK5085型有可靠性指标的表面安装膜固定电阻网络详细规范

Resistor network, fixed, film, surface mount, established reliability, style RNK5085 detail specificatiion for

LST42.02M型石英晶体滤波器详细规范

Filter,quartz crystal,Type LST42.02M,detail specification for

电子元器件用镀锡圆引线通用技术条件

General specifications for lead-tinned for electronic components

环境试验 2-58部分：试验 试验Td：表面组装元器件可焊性、金属化层耐溶蚀性和耐焊接热的试验方法

Environmental Testing Part 2-58: Test Test Td: Test Method for Solderability, Metallized Layer Corrosion Resistance and Soldering Heat Resistance of Surface Mount Components

环境试验 2-58部分：试验 试验Td：表面组装元器件可焊性、金属化层耐溶蚀性和耐焊接热的试验方法

Environmental Testing Part 2-58: Test Test Td: Test Method for Solderability, Metallized Layer Corrosion Resistance and Soldering Heat Resistance of Surface Mount Components

电子元器件用镀锡铜包钢线

Tinned copper clad wire for electronic components

航空航天系列 航空器用电缆 试验方法 第509部分：可焊性

Aerospace series - Cables, electrical, aircraft use - Test methods - Part 509: Solderability

航空航天系列 航空航天结构中材料的焊接性和钎焊性 第003部分：未合金化和低合金钢同质装配件的焊接与钎焊

Aerospace series - Weldability and brazeability of materials in aerospace constructions - Part 003: Welding and brazing of homogeneous assemblies of unalloyed and low alloy steels

航天系列 航空结构中材料的可焊接性和可钎焊性 第004部分：高合金钢同质组件的焊接与钎焊

Aerospace series - Weldability and brazeability of materials in aerospace constructions - Part 004: Welding and brazing of homogeneous assemblies of high alloyed steels

航空系列 航空结构中材料的可焊接性和可 brazing 性 第5部分：耐热镍或钴基合金的均匀装配

Aerospace series - Weldability and brazeability of materials in aerospace constructions - Part 005: Homogeneous assemblies of heat resisting Ni or Co base alloys

航空航天系列 航空航天结构中材料的可焊接性和可 brazing 性 第006部分：钛合金同质组件

Aerospace series - Weldability and brazeability of materials in aerospace constructions - Part 006: Homogeneous assemblies of titanium alloys

电阻焊 可焊性 第1部分：金属材料电阻点焊、缝焊和凸焊可焊性评定的一般要求

Resistance welding - Weldability - Part 1: General requirements for the evaluation of weldability for resistance spot, seam and projection welding of metallic materials (ISO 18278-1:2015)

电阻焊 可焊性 第2部分：点焊钢板的替代评估程序（ISO 18278-2:2004）

Resistance welding - Weldability - Part 2: Alternative procedures for the assessment of sheet steels for spot welding (ISO 18278-2:2004)

航空航天系列 电气和光学连接元件 测试方法 第514部分：使用独立焊料和助焊剂的触点的可焊性

Aerospace series. Elements of electrical and optical connection. Test methods. Part 514: Solderability of contacts with self-contained solder and flux (Endorsed by AENOR in August of 2002.)

航空航天系列 电缆、电气、飞机使用 测试方法 第509部分：可焊性

Aerospace series. Cables, electrical, aircraft use. Test methods. Part 509: Solderability (Endorsed by AENOR in August of 2002.)

环境测试 第2-20部分：测试 测试 T：含铅器件的可焊性和耐焊接热测试方法

Environmental testing- Part 2-20: Tests- Test T: Test methods for solderability and resistance to soldering heat of leaded devices (Endorsed by AENOR in January of 2010.)

环境测试 第2-58部分：测试 测试 Td：表面安装器件(SMD)的可焊性、金属化溶解性和焊接热耐受性的测试方法

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (Endorsed by AENOR in June of 2015.)

环境测试 第2-58部分：测试 测试 Td：表面安装器件(SMD)的可焊性、金属化溶解性和焊接热耐受性的测试方法

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (Endorsed by Asociación Espa?ola de Normalización in May of 2018.)

环境测试 第2-69部分：测试 测试 Te/Tc：通过润湿平衡（力测量）方法对电子元件和印刷板进行可焊性测试

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (Endorsed by Asociación Espa?ola de Normalización in October of 2019.)

特殊类型绕组线规范 第20部分：可焊聚氨酯漆包圆铜线 155 级

Specifications for particular types of winding wires - Part 20: Solderable polyurethane enamelled round copper wire, class 155

特殊类型绕组线规范 第21部分：聚酰胺外涂可焊聚氨酯漆包圆铜线 155 级

Specifications for particular types of winding wires - Part 21: Solderable polyurethane enamelled round copper wire overcoated with polyamide, class 155

特殊类型绕组线规范 第23部分：可焊聚酯酰亚胺漆包圆铜线 180 级

Specifications for particular types of winding wires - Part 23: Solderable polyesterimide enamelled round copper wire, class 180

表面安装技术 第1部分：表面安装元件(SMD)规范的标准方法

Surface mounting technology -- Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 61760-1:2006) (Endorsed by AENOR in September of 2006.)

环境试验 第2-58部分：试验 试验 Td：表面贴装器件（SMD）的可焊性 抗金属溶解性和焊接热性的试验方法（IEC 60068-2-58:2015 + A1:2017）

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability@ resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2015 + A1:2017); German version EN 60068-2-58:2015 + A1:

环境试验 第2-69部分：试验——Te/Tc试验：电子元件和印制板可焊性测试（湿式平衡法）

Environmental testing — Part 2-69: Tests — Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

环境试验 第2-69部分：试验 试验 Te/Tc：通过润湿天平（力测量）法对电子元件和印刷电路板进行可焊性试验 (IEC 60068-2-69:2017)

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 60068-2-69:2017); German version EN 60068-2-69:2017

环境试验 第2部分-69:测试-Te/Tc测试:电子元件和印制电路板的润湿平衡法(力测量)测试 (IEC 60068-2-69:2017 + COR1:2018 + A1:2019)

Environmental testing Part 2-69: Test - Te/Tc test: Wetting balance method (force measurement) test for electronic components and printed circuit boards (IEC 60068-2-69:2017 + COR1:2018 + A1:2019)

环境试验 第3-13部分：试验 T 焊接的支持文件和指南 (IEC 60068-3-13:2016)

Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering (IEC 60068-3-13:2016); German version EN 60068-3-13:2016

技术条件特定类型的绕线导线 第23部分：可锡焊的聚酯亚胺漆包圆铜线 等级180 (IEC 60317-23:2013 + A1:2019)

Specifications for certain types of wire-wound conductors Part 23: Solderable polyesterimide enamelled round copper wire, Grade 180 (IEC 60317-23:2013 + A1:2019)

Technische Lieferbedingungen fuer bestimmte Typen von Wickeldraehten - Teil 36: Runddraehte aus Kupfer@ verzinnbar und verbackbar@ lackisoliert mit Polyesterimid@ Temperaturindex 180 (IEC 55/1692/CDV:2018); Deutsche und Englische Fassung EN 60317-36:2014/

Specifications for particular types of winding wires - Part 36: Solderable polyesterimide enamelled round copper wire@ class 180@ with a bonding layer (IEC 55/1692/CDV:2018); German and English version EN 60317-36:2014/prA1:2018

德国工业协会焊接技术规范

Welding Technology Guidelines of VDI/VDE

精密工程组件 焊接连接

Precision engineering components - Solder connections

Manufacturing of printed circuits boards; conservation of soldering properties

Fertigung von Leiterplatten; Verfahren zur Erhaltung der Loetbarkeit

微接合术语

Micro Joining Terms