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环境试验．试验．T试验导则：焊接

Environmental testing - Tests - Guidance on test T: Soldering

实心和管状钎料焊丝.规范和试验方法.管状钎料焊丝效能的润湿平衡法

Solder wire, solid and flux cored - Specification and test methods - Wetting balance test method for flux core solder wire efficacy

软焊剂 测试方法 助焊剂功效测试、润湿天平法

Soft soldering fluxes. Test methods - Flux efficacy test, wetting balance method

基本环境试验.第2部分:试验.试验T指南:锡焊

Environmental testing - Part 2: Tests; guidance on test T: Soldering (IEC 60068-2-44:1995); German version EN 60068-2-44:1995

环境试验.第2-54部分:试验.试验Ta:通过润湿平衡法进行电子元件的软焊性试验

Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method (IEC 60068-2-54:2006); German version EN 60068-2-54:2006

环境测试.第2-69部分:试验.试验Te:润湿称量法进行表面安装美利体育官网首页网址(SMD)电子元件的可焊性测试

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method (IEC 60068-2-69:2007); German version EN 60068-2-69:2007

电子美利体育官网首页网址连接器.试验和测量.第12-7部分:焊接试验.试验12g.可焊性.湿润平衡法

Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests; Test 12g: Solderability, wetting balance method (IEC 60512-12-7:2001); German version EN 60512-12-7:2001

电子美利体育官网首页网址连接器 测试和测量 第12-7部分：焊接测试

Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests; Test 12g: Solderability, wetting balance method (IEC 60512-12-7:2001); German version EN 60512-12-7:2001

实心和管状钎料焊丝.规范和试验方法.第3部分:用润湿平衡试验方法测定管状钎焊焊丝的效能

Solder wire, solid and flux cored - Specifications and test methods - Part 3: Wetting balance test method for flux cored solder wire efficacy (ISO 12224-3:2003); German version EN ISO 12224-3:2003

软钎焊剂 试验方法 第16部分：钎剂功效试验,湿平衡法（草案）

Soldering flux test methods Part 16: Flux efficacy test, wet balance method (draft)

软焊剂 试验方法 第6部分：助焊剂功效试验，润湿平衡法

Soft soldering fluxes — Test methods — Part 16: Flux efficacy tests, wetting balance method

环境试验 第2-44部分:试验 试验T指南:锡焊

Environmental testing - Part 2: Tests; Guidance on test T: Soldering

润湿平衡的标准重量比较试验

Wetting Balance Standard Weight Comparison Test

实心和管状钎料焊丝.规范和试验方法.第3部分:管状钎料焊丝效能的润湿平衡法

Solder wire, solid and flux cored - Specification and test methods - Part 3: Wetting balance method for flux cored solder wire efficacy

环境影响试验 第2-69部分：试验 方法：Te/Tc试验 电子元件和印刷电路板可焊性试验 润湿天平（测力）法 (IEC 60068-2-69:2017)

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 60068-2-69:2017)

环境测试 第2-69部分：测试 测试 Te/Tc：通过润湿平衡（力测量）方法对电子元件和印刷板进行可焊性测试

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (Endorsed by Asociación Espa?ola de Normalización in October of 2019.)

环境试验 - 第2-69部分：测试 - 测试Te/Tc: 通过浸润天平方法对电子元件和印制板进行焊性测试

Environmental testing — Part 2-69: Tests — Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

环境试验 第2部分-69:测试-Te/Tc测试:电子元件和印制电路板的润湿平衡法(力测量)测试 (IEC 60068-2-69:2017 + COR1:2018 + A1:2019)

Environmental testing Part 2-69: Test - Te/Tc test: Wetting balance method (force measurement) test for electronic components and printed circuit boards (IEC 60068-2-69:2017 + COR1:2018 + A1:2019)