美利体育登录入口官网

钎焊电子组件的工艺要求.总则

Workmanship requirements for soldered electronic assemblies - General

半导体器件.机械和气候试验方法.第30部分:可靠性测试前非密封表面安装美利体育官网首页网址预处理(IEC 60749-30-2005+A1-2011).德文版 EN 60749-30-2005+A1-2011

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011); German version EN 60749-30:2005 + A1:2011

半导体器件 机械和气候测试方法 第 20-1 部分：对水分和焊接热的综合影响敏感的表面贴装器件的处理、包装、标签和运输（IEC 47/2488/CDV:2018）

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2488/CDV:2018); German and English version

半导体器件 机械和气候试验方法 第30部分：可靠性试验前非密封表面贴装器件的预处理 (IEC 60749-30:2020)

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2020); German version EN IEC 60749-30:2020

半导体器件 机械和气候测试方法 第30部分：可靠性测试前非密封表面贴装器件的预处理

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2020); German version EN IEC 60749-30:2020 / Note: DIN EN 60749-30 (2011-12) remain...

半导体器件 - 机械和气候测试方法 - 第20-1部分:表面贴装装置的处理 包装 标签和运输对水分和焊接热的综合影响敏感

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering

半导体器件.机械和气候试验方法.第21部分:可焊性

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

电气材料、印制板和其他互连结构和组件的试验方法第5-601部分:材料和组件的一般试验方法焊点的回流焊接能力试验和印制板的回流耐热试验

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability tes

表面组装技术 第4部分：潮湿敏感器件的分类、包装、标签和处置

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

表面贴装技术 - 第4部分：湿敏器件的分类、包装、标签和处理

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

非密封表面安装器件（SMDS）的湿气/再流敏感性分类

Moisture/Reflow Sensitivity Classification of Non-Hermetic Surface Mount Devices (SMDS)

环境测试 第3-15部分：支持文件和指南 真空辅助回流焊接

Environmental testing Part 3-15: Supporting documentation and guidance — Vacuum-assisted reflow soldering