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半导体器件的机械标准化.表面安装半导体器件封装外形图绘制的一般规则.小外形J-引线封装(SOJ)的封装尺寸规格测量方法

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)

半导体器件的机械标准化.表面安装半导体器件封装外形图绘制的一般规则.小外形封装(SOP)尺寸的测量方法

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)

半导体器件的机械标准化 表面安装半导体器件封装外形图编制的一般规则 四方扁平封装（QFP）封装尺寸的测量方法

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of quad flat packs (QFP)

半导体器件的机械标准化.绘制表面安装半导体器件封装外形图的一般规则.焊球网格阵列封装尺寸的测量方法

Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

表面安装技术.表面安装元件(SMDs)规范的标准方法

Surface mounting technology. Standard method for the specification of surface mounting components (SMDs)

电子组装技术.电子模块

Electronics assembly technology. Electronic modules

半导体器件的机械标准化.第6-20部分:表面安装半导体器件封装外形图绘制的一般规则.小外形J-引线封装(SOJ)的封装尺寸规格测量方法(IEC

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC

半导体器件机械标准化 第6-20部分：表面安装半导体器件封装外形图绘制的一般规则 小外形 J 引线封装封装尺寸的测量方法

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (I...

半导体器件的机械标准化.第6-21部分:表面安装半导体器件封装外形图绘制的一般规则.小外形封装(SOJ)的封装尺寸规格测量方法(IEC 60191-6

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6

半导体器件机械标准化 第6-21部分：表面安装半导体器件封装外形图绘制的一般规则 小外形封装封装尺寸的测量方法

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 6019...

半导体装置的机械标准化.第6-3部分:表面安装的半导体装置包装外廓图绘制一般规则.包装尺寸测量方法

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000);

半导体器件机械标准化第6-3部分：表面安装半导体器件封装外形图编制的一般规则

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:200...

半导体器件机械标准化 第6-4部分：表面安装半导体器件封装外形图编制通则 球栅阵列封装尺寸测量方法

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:20...

表面安装技术.第1部分:表面安装元器件(SMDS)规范的标准方法(IEC 61760-1-2006)

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 61760-1:2006); German version EN 61760-1:2006

印刷电路板和印刷电路板构造和应用 第6部分 4：连接区域图案的构造SMD 尺寸图有关连接区域图像构造的一般要求

Printed circuit boards and printed circuit boards – Construction and application – Part 6 4: Construction of the connection area pattern – General requirements for SMD dimensional drawings regarding the construction of the connection area image

半导体器件的机械标准化.第6-20部分:表面安装半导体器件封装外形图绘制准备的一般规则.小外形J-铅封装(SOJ)的包装尺寸规格用测量方法

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)

半导体器件的机械标准化 第6-3部分:绘制表面安装半导体器件封装外形图的一般规则 四面扁平封装尺寸的测量方法

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quad flat packs (QFP)

半导体器件的机械标准化.第6-4部分:绘制表面安装半导体器件封装外形图的一般规则.焊球网格陈列封装尺寸的测量方法 图绘制的一般规则.球状网格阵列（BGA）封装尺寸的测量方法

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of ball grid array (BGA)

表面贴装技术 - 第1部分:表面贴装元件（Smds）规范的标准方法

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

表面贴装技术 第1部分：表面贴装元器件（SMD）的标准规范方法

Surface mounting technology. - Part 1: Standard method for the specification of surface mounting components (SMDs)

电子组装技术.电子模块

Electronics assembly technology - Electronic modules

高温印制板平整度指南

High Temperature Printed Board Flatness Guideline

半导体器件标准化 第6-4部分 表面贴装半导体器件外壳尺寸绘图通用规则 球栅阵列 (BGA) 封装尺寸测量方法 (IEC 60191-6-4:2003)

Mechanical standardization of semiconductor devices -- Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

半导体器件机械标准化 第6-4部分：表面安装半导体器件封装外形图编制通则 球栅阵列封装尺寸测量方法

Mechanical standardization of semiconductor devices -- Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (Endorsed by AEN...

表面安装技术 第1部分：表面安装元件(SMD)规范的标准方法

Surface mounting technology -- Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 61760-1:2006) (Endorsed by AENOR in September of 2006.)