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环境试验.试验.试验Td.表面安装美利体育官网首页网址(SMD)的可焊性,耐金属化溶融和耐焊接热试验方法

Environmental testing - Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

环境测试 测试 测试 Ta 和 Tb：带引线器件的可焊性和耐焊热性的测试方法

Environmental testing. Tests. Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads

环境试验.第2-20部分:试验.试验T:带导线装置的可焊接性和焊接热抵抗性的试验方法

Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads (IEC 60068-2-20:2008); German version EN 60068-2-20:2008

环境测试

Environmental testing

环境测试 第3-13部分：测试T焊接的支持文件和指南（草案）

Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering

电子美利体育官网首页网址用连接器.试验和测量.第12-4部分:钎焊试验.试验12d:焊料湿浴法测量耐钎焊热(IEC 60512-12-4:2006)

Connectors for electronic equipment - Tests and measurements - Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method (IEC 60512-12-4:2006); German version EN 60512-12-4:2006

电子美利体育官网首页网址连接器 测试和测量 第12-4部分：焊接测试 测试 12d：耐焊接热 焊浴法

Connectors for electronic equipment - Tests and measurements - Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method (IEC 60512-12-4:2006); German version EN 60512-12-4:2006

环境试验. 第2部分: 试验. 试验Ta和试验Tb: 带导线装置的可焊接性和焊接热抵抗性的试验方法

Environmental testing - Part 2-20: Tests - Tests Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads

环境试验.第2-20部分:试验.试验T:带导线装置的可焊接性和焊接热抵抗性的试验方法

Environmental testing -- Part 2-20: Tests -- Test T: Test methods for solderability and resistance to soldering heat of devices with leads

环境试验.第2-58部分:试验.试验Td.表面安装元器件(SMD)用可焊性、耐金属化溶融和耐焊接热试验方法

Environmental testing - Part 2-58 : tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD).

环境测试 第2-20部分：测试 测试 T：含铅器件的可焊性和耐焊接热测试方法

Environmental testing- Part 2-20: Tests- Test T: Test methods for solderability and resistance to soldering heat of leaded devices (Endorsed by AENOR in January of 2010.)

环境测试 第2-58部分：测试 测试 Td：表面安装器件(SMD)的可焊性、金属化溶解性和焊接热耐受性的测试方法

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (Endorsed by AENOR in June of 2015.)

环境试验 第2-58部分：试验 试验 Td：表面贴装器件（SMD）的可焊性 抗金属溶解性和焊接热性的试验方法（IEC 60068-2-58:2015 + A1:2017）

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability@ resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2015 + A1:2017); German version EN 60068-2-58:2015 + A1: