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环境试验．试验．Ta试验：湿润天平法焊接试验

Environmental testing - Tests - Test Ta: Soldering - Solderability testing by the wetting balance method

环境试验．试验．Te试验：通过润湿天平法对表面安装技术用电子组件进行可焊性试验

Environmental testing - Tests - Test Te: Soldering - Solderability testing of electronic components for surface mount technology by the wetting balance method

环境测试.试验.试验Te:用润湿平衡法对表面安装美利体育官网首页网址(SMD)电子元件的软钎焊性试验

Environmental testing - Tests - Test Te - Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

环境测试 试验 试验Tf：使用焊锡膏通过润湿平衡法对用于表面贴装器件（SMD）的电子元件进行可焊性试验

Environmental testing - Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

环境试验 第2-83部分：试验 试验Tf：采用润湿天平法对表面贴装器件（SMD）用电子元件的可焊性进行测试

Environmental testing – Part 2-83: Tests – Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

软钎焊剂 试验方法 第16部分：钎剂功效试验,湿平衡法（草案）

Soldering flux test methods Part 16: Flux efficacy test, wet balance method (draft)

环境试验. 第2-83部分. 试验. 试验Tf. 利用焊锡膏湿平衡法进行的表面安装美利体育官网首页网址电子元件焊接性试验

Environmental testing. Part 2-83. Tests. Test Tf. Solderability testing of electronic components for surface mounting devices by the wetting balance method using solder paste

环境测试 第2-83部分：测试 测试Tf：使用润湿平衡法对表面贴装器件（SMD）用电子元件进行可焊性测试

Environmental testing. - Part 2-83: Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

环境试验 - 第2-83部分：试验 - 焊锡性试验

Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

环境试验 第2-83部分：试验 试验Tf：使用焊膏润湿平衡法对表面安装器件(SMD)电子元器件进行的可焊性测试

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

软钎焊剂.试验方法.第16部分:钎剂功效试验,湿平衡法

Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method

软焊剂 试验方法 第16部分：助焊剂功效试验 润湿平衡法

Soft soldering fluxes — Test methods — Part 16: Flux efficacy test, wetting balance method

电子美利体育官网首页网址用连接器.试验和测量.第12-7部分:锡焊试验.试验12g:湿润平衡法测定可焊性

Connectors for electronic equipment -- Tests and measurements -- Part 12-7: Soldering tests -- Test 12g: Solderability, wetting balance method

无铅焊剂的试验方法.第4部分:用湿平衡法和接触角法测定钎焊性的试验方法

Test methods for lead-free solders -- Part 4: Methods for solderbility test by a wetting balance method and a contact angle method

环境试验 第2-83部分：试验 Tf试验 采用焊膏的润湿天平法对表面安装美利体育官网首页网址电子元件的可焊性试验（IEC 60068-2-83:2025）

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste (IEC 60068-2-83:2025)

软焊剂 试验方法 第16部分：活性测试 润湿平衡法（ISO 9455-16:2019）

Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method (ISO 9455-16:2019)