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用于自动处理厚度通常小于 1.0mm 的器件的单片裸芯片和其他表面贴装元件的背胶冲孔塑料载带

Adhesive Backed Punched Plastic Carrier Taping of Singulated Bare Die and Other Surface Mount Components for Automatic Handling of Devices Generally Less Than 1.0mm Thick

用于自动处理的微型表面贴装元件的 4 mm 压纹载带

4 mm Embossed Carrier Taping of Micro-Sized Surface Mount Components for Automatic Handling

表面安装技术.表面安装元件(SMDs)规范的标准方法

Surface mounting technology. Standard method for the specification of surface mounting components (SMDs)

环境试验.第2-21部分:试验.试验U:终端和整体安装装置的坚固性

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices (IEC 60068-2-21:2006); German version EN 60068-2-21:2006

环境测试.第2-69部分:试验.试验Te:润湿称量法进行表面安装美利体育官网首页网址(SMD)电子元件的可焊性测试

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method (IEC 60068-2-69:2007); German version EN 60068-2-69:2007

自动搬运用部件的包装. 第3部分: 连续带上表面安装部件的包装(IEC 60286-3-2013); 德文版本EN 60286-3-2013

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2013); German version EN 60286-3:2013

自动装配用元件的包装.第6部分:表面安装组件的散装盒包装

Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components (IEC 60286-6:2004); German version EN 60286-6:2004

自动处理元件的包装 第6部分：表面安装元件的散装箱包装

Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components (IEC 60286-6:2004); German version EN 60286-6:2004 / Note: DIN EN 60286-6 (1999-05) remains valid alongside this standard until 2007-03-01.

半导体器件 - 机械和气候测试方法 - 第 37 部分：使用加速度计的板级跌落测试方法 (IEC 60749-37:2008)

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2008); German version EN 60749-37:2008 / Note: To be replaced by DIN EN IEC 60749-37 (2023-02).

表面安装技术.第1部分:表面安装元器件(SMDS)规范的标准方法(IEC 61760-1-2006)

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 61760-1:2006); German version EN 61760-1:2006

用于频率控制和选择的表面贴装压电器件 标准外形和端子引线连接 第3部分：金属外壳

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosures (IEC 61837-3:2015); German version EN 61837-3:2015 / Note: DIN EN 61837-3 (2001-09) remains valid alo...

自动处理的机械互锁元件包装

Mechanically-Interlocked Component Packaging for Automatic Handling

无线电电子美利体育官网首页网址的电子模块的焊接 使用无铅和传统技术进行自动混合和表面安装 装配安装技术要求

Soldering of electronic modules of radio-electronic means. Automated mixed and surface mounting using lead-free and conventional technology. Requirements for assembly and installation technology

印制板和印制板组件.设计和使用.第6-4部分:版图设计.从版图设计的角度看表面安装组件（SMD）尺寸图的一般要求

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of l

印刷电路板组件. 第2部分: 分规范. 表面安装焊接组件的要求

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

表面贴装技术 第 1 部分：表面贴装元件（SMD）的规范标准方法

Surface mounting technology Part 1: Standard method for the specification of surface mounting components (SMDs)

手持电子产品组件的板级跌落试验方法

Board Level Drop Test Method of Components for Handheld Electronic Products

自动搬运元器件包装第3部分：连续带上表面贴装元器件的包装

Packaging of components for automatic handling-Part 3: Packaging of surface mount components on continuous tapes

自动化处理用组件的包装.第6部分:表面安装组件的散装箱包装

Packaging of components for automatic handling -- Part 6: Bulk case packaging for surface mounting components

表面贴装技术 第2部分：表面贴装器件（SMD）的运输和储存条件 应用指南

Surface mounting technology -- Part 2: Transportation and storage conditions of surface mounting devices (SMD) -- Application guide

表面安装技术 第1部分：表面安装元件(SMD)规范的标准方法

Surface mounting technology -- Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 61760-1:2006) (Endorsed by AENOR in September of 2006.)