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测量润滑液极压性能的标准试验方法 (四球法)

Standard Test Method for Measurement of Extreme-Pressure Properties of Lubricating Fluids (Four-Ball Method)

材料在结构和组件中的性能预测测试技术报告

Testing for Prediction of Material Performance in Structures and Components

空间产品保证.高可靠性电气连接件的手动钎焊

Space product assurance - The manual soldering of high-reliability electrical connections

锡和锡合金.锡铅合金和锡铅合金器皿.第2部分:锡铅合金器皿

Tin and tin alloys - Pewter and pewterware - Pewterware

印制电路板和印制电路板组件.设计和使用.焊接(焊接区/焊缝)要求.区域阵列组件(BGA、FBGA、CGA、LGA)

Printed boards and printed board assemblies — Design and use — Part 5-8: Attachment (land/joint) considerations — Area array components (BGA, FBGA, CGA, LGA)

印制板组件 第2部分：分规范 — 表面贴装焊接组件的要求

Printed board assemblies Part 2 : Sectional specification — Requirements for surface mount soldered assemblies

电子装配技术.焊缝用环境和耐久性试验方法的选择指南

Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints

空间产品保证.高可靠性电气连接件的手动钎焊

Space product assurance - The manual soldering of high-reliability electrical connections; German version EN 50390:2004

半导体器件.机械和气候试验方法.第25部分:温度循环

Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling (IEC 60749-25:2003); German version EN 60749-25:2003

半导体器件 机械和气候测试方法 第25部分：温度循环

Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling (IEC 60749-25:2003); German version EN 60749-25:2003 / Note: Under certain conditions, DIN EN 60749 (2002-09) remains valid alongside this standard until 2006-0...

印刷电路板组件.第4部分:分规范.接线端焊接组件的要求

Printed board assemblies - Part 4: Sectional specification: Requirements for terminal soldered assemblies (IEC 61191-4:1998); German version EN 61191-4:1998

表面安装技术.表面安装焊点的环境忍受力试验方法.第1-4部分:周期性挠曲试验(IEC 62137-1-4:2009),德文版本EN 62137-1-4:2009

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test (IEC 62137-1-4:2009); German version EN 62137-1-4:2009

电子组装技术.第3部分:焊接接缝用环境和耐久性试验方法筛选导则(IEC 62137-3-2011).德文版本EN 62137-3-2012

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (IEC 62137-3:2011); German version EN 62137-3:2012

电子组装技术-第3部分：焊点环境和耐久性测试方法选择指南

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (IEC 62137-3:2011); German version EN 62137-3:2012

电子组装技术 第4部分：区域阵列类型包装表面安装美利体育官网首页网址的焊接接缝的耐久性试验方法（草案）

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices

电阻焊接.焊接头的破坏性试验.多点焊接样品的疲劳试验用方法(ISO 18592-2009).德文版本EN ISO 18592-2009

Resistance welding - Destructive testing of welds - Method for the fatigue testing of multi-spot-welded specimens (ISO 18592:2009); German version EN ISO 18592:2009

航空电子过程管理 包含无铅焊料的航空航天和国防电子产品 第3部分：含无铅焊料和镀层系统的性能测试

Avionics process management - Aerospace and defence electronic products containing lead-free solders - Part 3: Performance testing of lead-free solder and plating systems

印制板组装 第3部分;分规范 通孔安装焊接组装的要求

Printed board assemblies--Part 3:Sectional specification-Requirements for through-hole mount soldered assemblies

印制板组装 第6部分:球栅阵列（BGA）和盘栅阵列（LGA）焊点空洞的评估要求及测试方法

Printed Board Assembly Part 6: Ball Grid Array (BGA) and Land Grid Array (LGA) Solder Joint Void Evaluation Requirements and Test Methods

表面安装印制板组装件通用要求

General requirements for surface mount printed board assemblies

表面安装器件焊点寿命试验方法及评价要求

Surface mount device solder joint life test method and evaluation requirements

印制板和印制板组件. 设计和使用. 第5-4部分. 连接 (焊盘/焊点) 考虑. 两面带有J形引线的部件

Printed boards and printed board assemblies. Design and use. Part 5-4. Attachment (land/joint) considerations. Components with J leads on two sides

印刷电路板组件. 第2部分: 表面安装组件. 技术要求

Printed board assemblies. Part 2. Surface mount assemblies. Technical requirements

半导体器件.机械和气候试验方法.第22部分:粘接强度

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

印制板和印制板组件.设计和使用.第5-8部分:附件(结合区/接头)考虑要素.区域阵列组件(BGA, FBGA, CGA, LGA)

Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

印刷电路板组件. 第2部分: 分规范. 表面安装焊接组件的要求

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

印刷电路板组件 第3部分:分规范 通孔安装焊接组件的要求

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

电子组装技术. 第4部分: 区域阵列类型包装表面安装美利体育官网首页网址的焊接接缝的耐久性试验方法

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices

无铅波峰焊接通用工艺规范

General technological specification for lead-free wavesoldering

仪器仪表印制板组装件修焊工艺规范

Repair welding process specification for printed board assembly of instrumentation

印制电路板及其结构 设计与使用 第5-4部分：连接（触点焊盘与接插件）特性 具有双面 J 型引线的组件（IEC 61188-5-4:2007）

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides (IEC 61188-5-4:2007)

表面安装技术 表面安装焊点的耐久性试验方法 第1-1部分：剥离强度试验（IEC 62137-1-1:2007）

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test (IEC 62137-1-1:2007)

表面安装技术 表面安装焊接接头的环境影响和耐久性试验方法 第1-3部分 循环跌落试验（IEC 62137-1-3:2008）

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test (IEC 62137-1-3:2008)

电子组装技术 第3部分：选择用于评估焊接接头环境影响和耐久性的试验方法 (IEC 62137-3:2011)

Electronics assembly technology -- Part 3: Selection guidance of environmental and endurance test methods for solder joints (IEC 62137-3:2011)

电子组装技术 第4部分：用于表面贴装器件矩阵封装锡焊连接的耐久性试验方法（IEC 62137-4:2014）

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014)

航天电子电气产品波峰焊接工艺技术要求

Technical requirements for wave soldering process of aerospace electronic and electrical products

航天用印制电路板组装件修复和改装技术要求

Technical requirements for repair and modification of printed circuit board assemblies for aerospace use

航天电子电气产品焊接通用技术要求

General technical requirements for welding of aerospace electronic and electrical products

电子工业专用美利体育官网首页网址电气装配技术要求

Electrical performance requirements for assembling of special equipment for electronic industry

电阻焊 焊缝破坏试验 电阻点焊、缝焊和突变焊的失效类型及几何测量（ISO 14329:2003）

Resistance welding - Destructive tests of welds - Failure types and geometric measurements for resistance spot, seam and projection welds (ISO 14329:2003)

印制板和印制板组件 设计和使用 第5-8部分：附件（焊盘/接头）注意事项 区域阵列元件（BGA、FBGA、CGA、LGA）

Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (Endorsed by AENOR in July of 2008.)