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半导体装置.机械和气候试验方法.使用加速计的电路板级落锤试验方法

Semiconductor devices — Mechanical and climatic test methods — Part 37: Board level drop test method using an accelerometer

印制板组件 截面规范 端子焊接组件的要求

Printed board assemblies - Sectional specification. Requirements for terminal soldered assemblies

推动循环经济实践：PBAs的维修与回收

Enabling Circular Economy Practices: Repair and Recycling of PBAs

电气材料,印刷电路板和其它互联结构和组件的试验方法.第5-1部分:材料和组件的通用试验方法.印刷电路板组件的指南(IEC 61189-5-1-2016);德文版本EN 61189-5-1-2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (IEC 61189-5-1:2016); German version EN 61189-5

电气材料, 印刷电路板和其它互联结构和组件的试验方法 第5-2部分：材料和组件的通用试验方法 印刷电路板组件的焊接焊剂（草案）

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies

电气材料, 印刷电路板和其它互联结构和组件的试验方法 第5-3部分：材料和组件的通用试验方法 印刷电路板组件的焊接焊膏（草案）

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

电气材料, 印刷电路板和其它互联结构和组件的试验方法. 第5-3部分: 材料和组件的通用试验方法. 印刷电路板组件的焊接焊膏 (IEC 61189-5-3-2015); 德文版本EN 61189-5-3-2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (IEC 61189-5-3:2015); German version EN

电气材料、印制板和其他互连结构和组件的测试方法 第5-3部分：材料和组件的通用测试方法 印制板组件的焊膏

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (IEC 61189-5-3:2015); German version ...

电气材料, 印刷电路板和其它互联结构和组件的试验方法 第5-4部分：材料和组件的通用试验方法 印刷电路板组件的焊接合金和带焊剂与不带焊剂的实心焊丝（草案）

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

印刷电路板组件.第2部分:分规范.表面安装焊接组件的要求(IEC 61191-2-2013).德文版本EN 61191-2-2013

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2013); German version EN 61191-2:2013

印刷电路板组件.第4部分:分规范.接线端焊接组件的要求(IEC 61191-4-2017); 德文版本EN 61191-4-2017

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies (IEC 61191-4:2017); German version EN 61191-4:2017

印制板组件 第1部分：通用规范 使用表面贴装和相关组装技术的焊接电气和电子组件的要求

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2018); German version EN IEC 61191-1:2018 / Note: DIN EN 61191-...

轨道交通.全部车辆用电子美利体育官网首页网址

Railway applications - Electronic equipment used on rolling stock

印制电路板和印制电路板组件 设计和使用 第1-1部分:一般要求 电子组件的平整度情况

Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies

电气材料 印刷电路板和其他互连结构和组件的测试方法 - 第5-1部分:材料和组件的一般测试方法 - 印刷电路板组件的指导

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board ass

电气材料、印制板和其他互连结构和组件的测试方法 第 5-3 部分：材料和组件的通用测试方法 用于印制板组件的焊料合金和助焊剂和非助焊剂实心线

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

电气材料、互连结构和组件的试验方法.第5部分:印制电路板组件的试验方法

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

印制板组件 第1部分：通用规范 使用表面贴装和相关组装技术的焊接电气和电子组件的要求

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

印刷电路板组件. 第2部分: 分规范. 表面安装焊接组件的要求

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

电子部件的返工、修订和维修[替代:IPC R-700C]

REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES [Superseded: IPC R-700C]

印制板,组装件和支持图纸的文件要求

Documentation Requirements for Printed Boards, Assemblies and Support Drawings

宇宙产品质量保证 用于太空目的的印刷电路板组装的维修与修改

Space product assurance - Repair and modification of printed circuit board assemblies for space use

铁道应用 机车车辆 电子美利体育官网首页网址

Railway applications - Rolling stock - Electronic equipment

印制电路板及其组装 制造和使用 第5-2部分：安装（接触端子和连接）特性 分立元件 (IEC 61188-5-2:2003)

Printed boards and printed board assemblies. Design and use. Part 5-2: Attachment (land/joint) considerations - Discrete components (IEC 61188-5-2:2003)

印刷电路板及其组装 构造与使用 第5-3部分 连接（触点与接点）特性 具有双边引脚的元件（IEC 61188-5-3:2007）

Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides (IEC 61188-5-3:2007)

印制电路板及其装配 设计与应用 第5-5部分：连接（接触焊盘和连接器）的特殊要求 四侧引脚元件（IEC 61188-5-5:2007）

Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides (IEC 61188-5-5:2007)

印刷电路板组装 第1部分：通用规范 对采用表面贴装技术和相关组装技术组装的焊接型电气和电子组件的要求（IEC 61191-1:2018）

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2018)

铁路应用 机车车辆上使用的电子美利体育官网首页网址

Railway applications - Electronic equipment used on rolling stock

电气材料、印制板和其他互连结构和组件的测试方法 第5-1部分：材料和组件的通用测试方法 印制板组件指南

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (Endorsed by AENOR in November of 2016.)

电气材料、印制板和其他互连结构和组件的测试方法 第5-2部分：材料和组件的通用测试方法 印制板组件的助焊剂

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies (Endorsed by AENOR in April of 2015.)