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详细规格：固定低功率薄膜高稳定性 SMD 电阻器 矩形的 稳定性等级 0,1； 0,25

Detail Specification: Fixed low power film high stability SMD resistors. Rectangular. Stability classes 0,1; 0,25

印刷板组件 剖面规范 通孔安装焊接组件的要求

Printed board assemblies. Sectional specification. Requirements for through-hole mount soldered assemblies

表面贴装技术 通孔回流焊(THR)焊接元件规格的标准方法

Surface mounting technology. Standard method for the specification of components for through-hole reflow (THR) soldering

空白详细规范.经质量评定的线绕表面安装电感线圈.评定等级 E

Blank detail specification: wirewound surface mounting inductors of assessed quality; assessment level E; German version EN 129101:1993

航天产品保证 表面贴装、混合技术和手动安装电气连接的高可靠性焊接（草案）

Space product assurance - High-reliability soldering for surface mount, mixed technology and hand-mounted electrical connections

半导体器件机械标准化第6部分：表面安装半导体器件封装外形图编制的一般规则

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009 / Note: DIN EN 60191-6 (2005-04) rem...

印制电路板和印制电路板组件.设计和使用.第5-1部分:焊接(焊接区/接缝)考虑.总要求

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements (IEC 61188-5-1:2002); German version EN 61188-5-1:2002

印刷电路板组件 第1部分：总规范 使用表面安装和相关装配技术的焊接电气和电子组件的要求（草案）

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

印刷电路板组件 第1部分：总规范 使用表面安装和相关装配技术的焊接电气和电子组件的要求

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

印刷电路板组件. 第1部分: 总规范. 使用表面安装和相关装配技术的焊接电气和电子组件的要求(IEC 61191-1-2013); 德文版本EN 61191-1-2013

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2013); German version EN 61191-1:2013

印刷电路板组件.第2部分:分规范.表面安装焊接组件的要求(IEC 61191-2-2013).德文版本EN 61191-2-2013

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2013); German version EN 61191-2:2013

表面安装技术.表面安装焊点的环境忍受力试验方法.第1-4部分:周期性挠曲试验(IEC 62137-1-4:2009),德文版本EN 62137-1-4:2009

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test (IEC 62137-1-4:2009); German version EN 62137-1-4:2009

印制板组件 第1部分：通用规范 使用表面贴装和相关组装技术的焊接电气和电子组件的要求

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2018); German version EN IEC 61191-1:2018 / Note: DIN EN 61191-...

印制板组件 第1部分：通用规范 使用表面贴装和相关组装技术的焊接电气和电子组件的要求

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

印制板组件.第1部分:总规范.使用表面安装和相关组装技术的焊接电气和电子组件的要求

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

表面贴装技术 第 1 部分：表面贴装元件（SMD）的规范标准方法

Surface mounting technology Part 1: Standard method for the specification of surface mounting components (SMDs)

模板设计指导

BUILD ELECTRONICS BETTER - TEMPLATE DESIGN GUIDE

印制板组件焊盘凹坑表征的测试方法

Test Methods for Characterization of Printed Board Assembly Pad Cratering

组装和接合手册

Assembly and Joining Handbook

机械冲击原位电气计量测试指南用于FCBGA表面贴装组件焊接裂纹和焊盘凹陷/轨迹裂纹的美利体育登录入口官网

Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection

外部贴装过程中的准则和清单

SMT Process Guideline and Checklist

表面安装技术 表面安装焊点的耐久性试验方法 第1-1部分：剥离强度试验（IEC 62137-1-1:2007）

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test (IEC 62137-1-1:2007)

表面安装技术 表面安装焊接接头的环境影响和耐久性试验方法 第1-3部分 循环跌落试验（IEC 62137-1-3:2008）

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test (IEC 62137-1-3:2008)

印刷电路板组装 第1部分：通用规范 对采用表面贴装技术和相关组装技术组装的焊接型电气和电子组件的要求（IEC 61191-1:2018）

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2018)

印制板和印制板组件 设计和使用 第5-1部分：附件（焊盘/接头）注意事项 通用要求

Printed boards and printed board assemblies - Design and use -- Part 5-1: Attachment (land/joint) considerations - Generic requirements (Endorsed by AENOR in January of 2003.)

印制板组装 第1部分：通用规范 表面安装和相关技术连接的电气及电子组装要求（IEC 61191-1:2013）

Printed board assembly Part 1: General specification Requirements for electrical and electronic assemblies for surface mounting and related technical connections (IEC 61191-1:2013)

印制板组件 第1部分：通用规范 使用表面贴装和相关组装技术的焊接电气和电子组件的要求

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (Endorsed by Asociación Espa?ola de Normalización in December of 2018.)