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半导体器件的机械标准化.绘制表面安装半导体器件封装外形图的一般规则.焊球网格阵列封装尺寸的测量方法

Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

产品几何规范（GPS） - 表面缺陷 - 术语、定义和参数

Geometrical Product Specification (GPS) — Surface imperfections — Terms, definitions and parameters

黑色金属部件上的黑色氧化物涂层 要求和测试方法

Black oxide coatings on ferrous metal components - Requirements and test methods

半导体器件的机械标准化.第3部分:集成线路外形图绘制的一般规则

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999

用于测试防护头盔的头模

Headforms for use in the testing of protective helmets; German version EN 960:2006

产品几何量技术规范(GPS)表面缺陷 术语、定义及参数

Geometrical product specifications(GPS) Surface imperfections--Terms.definitions and parameters

角度量块

Angle block gauge

薄板冲压模装置.精度标准

Units for sheet stamping dies. Norms of accuracy

半导体器件的机械标准化.第6-4部分:绘制表面安装半导体器件封装外形图的一般规则.焊球网格陈列封装尺寸的测量方法 图绘制的一般规则.球状网格阵列（BGA）封装尺寸的测量方法

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of ball grid array (BGA)

圆柱齿轮 实用检验规则 第3部分:轴心圆柱的齿轮坯料、轴心距和平行度的建议

Cylindrical gears - Code of inspection practice - Part 3: Recommendations relative to gear blanks, shaft centre distance and parallelism of axes

驱动轴组件试验程序

Test Procedures of Propeller Shaft Assembly

半导体器件标准化 第6-4部分 表面贴装半导体器件外壳尺寸绘图通用规则 球栅阵列 (BGA) 封装尺寸测量方法 (IEC 60191-6-4:2003)

Mechanical standardization of semiconductor devices -- Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

汽车传动轴总成技术条件及台架试验方法

Technical conditions and bench test methods of automobile transmission shaft assembly

雪深自动观测规范

Snow depth automatic observation specifications

用于对准和支撑 300 mm 晶圆载体的运动联轴器的机械规范

MECHANICAL SPECIFICATION FOR KINEMATIC COUPLINGS USED TO ALIGN AND SUPPORT 300 mm WAFER CARRIERS

300毫米后端处理框架盒装载端口临时规范

Provisional Specification for 300 mm Load Port for Frame Cassettes in Backend Process

半导体器件机械标准化 第6-4部分：表面安装半导体器件封装外形图编制通则 球栅阵列封装尺寸测量方法

Mechanical standardization of semiconductor devices -- Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (Endorsed by AEN...