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印制板设计、制造和组装.术语和定义

Printed board design, manufacture and assembly - Terms and definitions

电气材料, 印刷电路板和其它互联结构和组件的试验方法. 材料和组件的通用试验方法. 印刷电路板组件的指南

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Guidance for printed board assemblies

电气材料、互连结构和组件的试验方法.印制电路板组件的试验方法

Test methods for electrical materials, interconnection structures and assemblies –– Part 5: Test methods for printed board assemblies

印制板组件.第1部分:总规范.使用表面安装和相关组装技术的焊接电气和电子组件的要求

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

印制板组件 第3部分：分规范 通孔插装焊接组件的要求

Printed board assemblies -- Part 3: Sectional specification -- Requirements for through-hole mount soldered assemblies

电工材料、印刷电路板及其他互连件和组件的试验方法 第5-1部分：材料和组件的一般试验方法 印刷电路板组件指南（IEC 61189-5-1:2016）

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (IEC 61189-5-1:2016)

电工材料、印刷电路板和其他互连器件及组件的试验方法 第5-2部分：材料和组件的一般试验方法 印刷电路板组件的焊剂（IEC 61189-5-2:2015）

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies (IEC 61189-5-2:2015)

电气材料、印刷电路板及其他互连件与组件的测试方法 第5-3部分：材料与组件的通用测试方法 印刷电路板组件的焊膏（IEC 61189-5-3:2015）

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (IEC 61189-5-3:2015)

电气材料、印刷电路板和其他组件及组装件的试验方法 第5-4部分：材料与组装件的通用试验方法 印刷电路板的组装件焊接料和带助焊剂及不带助焊剂的焊料

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (I...

电气材料、互连结构和配件的试验方法 第5部分：印制电路板配件用试验方法

Test methods for electrical materials, interconnection structures and assemblies - Part 5 : test methods for printed board assemblies