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胶粘剂. 各向同性导电胶粘剂的试验方法. 电化学迁移试验方法

Adhesives. Test methods for isotropic electrically conductive adhesives. Electrochemical-migration test methods

电气材料,印刷电路板和其它互联结构和组件的试验方法.第5-1部分:材料和组件的通用试验方法.印刷电路板组件的指南(IEC 61189-5-1-2016);德文版本EN 61189-5-1-2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (IEC 61189-5-1:2016); German version EN 61189-5

电气材料、印制板和其他互连结构和组件的测试方法 第5-503部分：材料和组件的通用测试方法 导电阳极丝

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (IEC 61189-5-503:2017)...

软钎焊剂.试验方法.第17部分:钎焊剂残留物的表面绝缘电阻梳试验和电化学迁移试验

Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2002); English version of DIN EN ISO 9455-17:2006-09

软焊助焊剂试验方法第17部分：表面绝缘电阻梳状试验和助焊剂残留物电化学迁移试验

Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2002); German version EN ISO 9455-17:2006 / Note: To be replaced by DIN EN ISO 9455-17 (2022-08).

锡焊用助焊剂

Flux for tin soldering

电气材料, 印制板和其他互连结构和组合装置的试验方法. 第5-503部分: 材料和组合装置的通用试验方法. 电路板导电阳极丝(CAF)试验

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

印刷电路板组件 第 9 部分：汽车应用中使用的印刷电路板组件的电化学可靠性和离子污染 最佳实践

Printed board assemblies - Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications - Best practices

印制电路板和组件中的电化学迁移.机理和试验

Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

助焊剂要求

Flux Requirements

粘合剂. 各向同性的导电粘合剂的试验方法. 第8部分: 电化学迁移试验方法

Adhesives - Test methods for isotropic electrically conductive adhesives - Part 8: Electrochemical-migration test methods

软钎焊剂.试验方法.第17部分:钎焊剂残留物的表面绝缘电阻梳试验和电化学迁移试验

Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues

电气材料、印刷板和其他互连结构和组件的测试方法 材料和组件的通用测试方法 实施使用细间距测试结构进行表面 i 的比对评估

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for surface i...

印刷电路板组件 汽车应用中使用的印刷电路板组件的电化学可靠性和离子污染 最佳实践（英国标准）

Printed board assemblies Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications. Best practices (British Standard)

印刷线路板和组件中的电化学迁移 机制和测试

Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing

电子制造用水基清洗剂

Water-based cleaning agents for electronics manufacturing