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美国国家标准协会/照明工程学会/国际紫外光协会LM-92-22: 批准方法: 紫外LED的光学和电气测量

Approved Method: Optical and Electrical Measurement of Ultraviolet LEDs

批准的方法：LED 光源的光学和电气测量

Approved Method: Optical and Electrical Measurements of LED Sources

半导体压模制品.关于热模拟的信息要求

Semiconductor die products - Requirements for information concerning thermal simulation

半导体封装的热标准化 用于稳态分析的半导体封装的 3D 热模拟模型 离散封装

Thermal standardization on semiconductor packages - 3D thermal simulation models of semiconductor packages for steady-state analysis. Discrete packages

高功率 LED 的光学测量

Optical Measurement of High-Power LEDs

LED加速寿命试验方法

LED Accelerated Life Test Method

半导体压模产品.第6部分:关于热压摸信息要求

Semiconductor die products - Part 6: Requirements for information concerning thermal simulation (IEC 62258-6:2006); German version EN 62258-6:2006

半导体芯片产品 第6部分：有关热模拟的信息要求

Semiconductor die products - Part 6: Requirements for information concerning thermal simulation (IEC 62258-6:2006); German version EN 62258-6:2006 / Note: Applies in conjunction with DIN EN 62258-1 (2011-04), DIN EN 62258-2 (2011-12).

单半导体器件封装的热测量方法

Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device)

集成电路热测量方法 - 电气测试方法 (单一半导体器件)

Integrated Circuit Thermal Measurement Methods - Electrical Test Methods (Single Semiconductor Device)

发光二极管模块热特性瞬态测试方法

Transient thermal test method for light emitting diode modules

半导体器件第5-14部分:光电子器件发光二极管基于热反射法的表面温度试验方法

Semiconductor devices - Part 5-14: Optoelectronic devices - Light emitting diodes - Test method of the surface temperature based on the thermoreflectance method

半导体器件 机械和气候试验方法 第23部分：高温工作寿命

Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

半导体器件.机械和环境测试方法.第34部分:电力循环

Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling

半导体封装的热标准化 第2-1部分：用于稳态分析的半导体封装 3D 热模拟模型 分立封装

Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages

半导体封装的热标准化 第3部分：用于瞬态分析的离散半导体封装的热电路仿真模型

Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis

半导体封装的热标准化.第1部分:BGA QFP型半导体封装的热阻和热参数

Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

集成电路热测方法－电测方法(单半导体器件)

Integrated Circuit Thermal Measurement Method - Electrical Test Method (Single Semiconductor Device)

报告和使用电子封装热信息的指南

Guidelines for Reporting and Using Electronic Package Thermal Information

热测量术语和定义词汇表

Glossary of Thermal Measurement Terms and Definitions

集成电路热测试方法环境条件 自然对流（静止空气）

Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

用于多片包装的热试验环境改善

Thermal Test Environment Modifications for MultiChip Packages

热测量术语和定义词汇表

Glossary of Thermal Measurement Terms and Definitions

热测量术语和定义词汇表

Glossary of Thermal Measurement Terms and Definitions

热测量术语和定义词汇表

Glossary of Thermal Measurement Terms and Definitions

热测量术语和定义词汇表

Glossary of Thermal Measurement Terms and Definitions

微电路应用热设计指南

Guide of thermal design for microcircuit application

半导体器件 分立器件 碳化硅二极管可靠性试验方法

Semiconductor Devices Discrete Devices Silicon Carbide Diode Reliability Test Method

半导体红外发射二极管测量方法 第14部分：结温

Measurement methods for semiconductor infrared emitting diodes Part 14: Junction temperature

半导体红外发射二极管测量方法 第15部分：热阻

Measurement methods for semiconductor infrared emitting diodes Part 15: Thermal resistance

发光二极管热阻抗测试方法

Measurement Method for Real Thermal Resistance and Impedance of Light Emitting Diodes

LED 分级 第1部分：适用于汽车应用的一般要求和白色网格

LED-binning - Part 1: General requirements and white colour grid intended for automotive applications