美利体育登录入口官网

使用能量分散X射线荧光光谱法（EDXRF）鉴定和定量涂料和类似涂层材料中铅的标准试验方法

Standard Test Method for Identification and Quantification of Lead in Paint and Similar Coating Materials using Energy Dispersive X-ray Fluorescence Spectrometry (EDXRF)

电工产品 某些物质的测定 筛选 用X射线荧光光谱法测定铅、汞、镉、总铬、总溴、总磷、总氯、总锡和总锑含量

Determination of certain substances in electrotechnical products - Screening. Lead, mercury, cadmium, total chromium, total bromine, total phosphorus, total chlorine, total tin and total antimony content by X-ray fluorescence spectrometry

林木良种筛选规范

Specification for Screening of Superior Tree Species

空白详细规范.经质量认证的高负荷机电的全有或全无继电器( 密封式 5A至25A )

Blank detail specification; electromechanical all-or-nothing heavy load relays of assessed quality (hermetically sealed, 5 A to 25 A); german version EN 116303:1993

废弃物的特性描述. 使用便携式X射线荧光光谱仪对元素成分进行的筛选方法; 德文版本EN 16424-2014

Characterization of waste - Screening methods for the element composition by portable X-ray fluorescence instruments; German version EN 16424:2014

废物表征 便携式X射线荧光仪器元素成分筛选方法

Characterization of waste - Screening methods for the element composition by portable X-ray fluorescence instruments; German version EN 16424:2014

电工制品中特定物质的测定 第1部分：简介和概述

Determination of certain substances in electrotechnical products - Part 1: Introduction and overview

综合业务数字网(ISDN).主叫线路识别表示(CLIP)补充业务.业务描述(版本2.1.1)

Integrated Services Digital Network (ISDN); Calling Line Identification Presentation (CLIP); Supplementary Service; Service Description (V3.1.1)

半导体分立器件 小功率双极型晶体管空白详细规范

Semiconductor Discrete Devices - Small Power Bipolar Transistors - Blank Detail Specification

ZC545(ZWC-6B-1/2)型温补晶体振荡器详细规范

Detail specification for type ZC545(ZWC-6B-1/2)temperature compensated crystal oscillator

声表面波器件通用规范

General specification for surface acoustic wave devices

军用电子元器件筛选技术要求

Screening technical requirement for military electronic components

LC滤波器通用规范

General specification for LC filters

滚筒式丸粒筛选机

Tumbling cylinder pill sieve

废物描述 使用便携式X射线荧光美利体育登录入口官网确定元素成分的搜索方法

Characterization of waste - Screening methods for the element composition by portable X-ray fluorescence instruments

应力作用下可靠性验证 第2部分：元件（IEC 61163-2:2020）

Reliability stress screening - Part 2: Components (IEC 61163-2:2020)

微生物肥料功能菌株筛选与鉴评通则

General principles for screening and evaluation of functional strains of microbial fertilizer

进口元器件筛选指南

Screening Guide for Imported Components

军用微型计算机筛选技术条件

Military Microcomputer Screening Technical Conditions

微波器件通用规范

General Specification for Microwave Devices

PIN二极管筛选规范

PIN Diode Screening Specifications

半导体集成电路 JFET输入四运算放大器 JF147详细规范

Detail specification for semiconductor integrated circuit JFET input quad operational amplifier JF147

石英谐振器筛选要求

Screen requiremints of quartz crystal unit

硅桥式整流器筛选技术条件

Silicon Bridge Rectifier Screening Specifications

元器件筛选与复验管理要求

Component screening and re-inspection management requirements

密封电磁继电器筛选技术条件

Screening technical conditions for sealed electromagnetic relays

空间应用中塑料封装微电路的要求

Requirements for Plastic Encapsulated Microcircuits in Space Applications

军事和航空电子应用中塑料封装微电路的要求

Requirements for Plastic Encapsulated Microcircuits in Military and Avionics Applications

半导体分立器件.2CZ30型硅整流二极管详细规范

Semiconductor discrete device.Detail specification for type 2CZ30 silicon rectifier diode

半导体分立器件.2CK4148型硅开关二极管详细规范

Semiconductor discrete device.Detail specification for silicon switching diode for type 2CK4148

半导体分立器件2CK84型硅开关二极管详细规范

Semiconductor discrete devices Detail specificion for silicon switching diode for type 2CK84

微波组件通用规范

General specification for microwave assembly

半导体光电组件.CBGS2301微型双向光电定位器.详细规范

Semiconductor photoelectric assembly Detail specification for miniature duplex photoelectric localizer for type CBGS 2301

半导体分立器件.2CZ59型硅整流二极管详细规范

Semiconductor discrete device.Detail specification for type 2CZ59 silicon rectifier diode

半导体分立器件.CS3684～CS3687型硅N沟道结型场效应晶体管详细规范

Semiconductor discrete devices.Detail specification for type CS3684～CS3687 silicon N-channel junction mode field-effect transistors

半导体分立器件.3DA503型硅微波脉冲功率晶体管详细规范

Semiconductor discrete devices.Detail specification for type 3DA503 silicon microwave pulse power transistor

半导体分立器件.2CW100～121型玻璃钝化封装硅电压调整二极管详细规范

Semiconductor discrete devices.Detail specification for type 2CW100～121 glass passivation package silicon voltage-requlator diodes

半导体分立器件3DA519型硅微波脉冲功率晶体管详细规范

Semiconductor discrete devices Detail specification for type 3DA519 silicon microwave pulse power transistor

半导体分立器件.3DD155型功率晶体管详细规范

Semiconductor discrete device.Detail specification for type 3DD155 power transistor

半导体分立器件.CS4856～CS4861型硅N沟道耗尽型场效应晶体管详细规范

Semiconductor discrete device.Detail specification for types CS4856～CS4861 silicon N-channel deplition mode field-effect transistor

半导体分立器件.2CZ106型硅开关整流二极管详细规范

Semiconductor discrete device.Detail specification for type 2CZ106 silicon switching rectifier diode

半导体分立器件.3CD020型低频大功率晶体管详细规范

Semiconductor discrete device.Detail specification for type 3CD020 Low-frequency and high-power transistor

半导体分立器件.3DK100型NPN硅小功率开关晶体管详细规范

Semiconductor discrete device.Detail specification for type 3DK100 NPN silicon low-power switching transistor

半导体分立器件.CS4091～CS4093型硅N沟道耗尽型场效应晶体管详细规范

Semiconductor discrete device.Detail specification for type CS4091～CS4093 silicon N-channel deplition mode field-effect transistor

半导体分立器件.3DG143型NPN硅高频低噪声小功率晶体管详细规范

Semiconductor discrete devices.Detail specification for type 3DG143 NPN silicon high-frequency Low-noise Low-power transistor

半导体分立器件.2CJ4211、2CJ4212型阶跃恢复二极管详细规范

Semiconductor discrete devices.Detail specification for type 2CJ4211 and 2CJ4212 step recovery diodes

半导体集成电路JH2014型HTL触发器详细规范

Detail specification for type JH2014 HTL flip-flop of semiconductor integrated circuit

半导体集成电路.JW137、JW137M、JW137L型三端可调负输出电压调整器详细规范

Semiconductor integrated circuits.Detail specification for type JW137,JW137M and JW137L three terminal adjustabale negative voltage regulators

半导体集成电路.JC4504型CMOS六TTL/CMOS-CMOS电平转换器详细规范

Semiconductor integrated circuits.Detail specification for type JC4504 of CMOS Hex TTL/CMOS to CMOS converters

电子信息产品中有毒有害物质的美利体育登录入口官网方法

Testing methods for hazardous substances in electronic information products

电子电气产品中邻苯二甲酸酯类物质的测定 热解析-气相色谱法

Determination of Phthalates in Electrical and Electronic Products by Thermal Desorption-Gas Chromatography

废物特性 便携式X射线荧光仪器的元素成分筛查方法

Characterization of waste - Screening methods for the element composition by portable X-ray fluorescence instruments

IEC 62153-4-1：2010

Metallic communication cable test methods – Part 4-1: Electromagnetic compatibility (EMC) – Introduction to electromagnetic (EMC) screening measurements