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表面安装技术——第4部分：湿敏元件的分类、包装、标签和操作

Surface mounting technology — Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

半导体器件.机械和气候试验方法.第20-1部分:对水分和焊接热综合效应敏感的表面安装美利体育官网首页网址的处理,包装,标签和运输(IEC 60749-20-1:2009),德文版本EN 60749-20

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009); German version EN 60749-20-

半导体器件 机械和气候测试方法 第20-1部分：对湿气和焊接热的综合影响敏感的表面贴装器件的处理、包装、标签和运输

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009); German version EN 60749-...

电子元器件 半导体器件长期贮存 第4部分：贮存

Electronic Components Semiconductor Devices Long-Term Storage Part 4: Storage

表面安装技术.第4部分:湿敏器件的分类、包装、标签和处理

Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

表面组装技术 第4部分：湿敏器件的分类、封装、标签和 handling

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

电子元件.电子半导体器件的长期贮存.第1部分:一般

Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General

印制板处理和存储指南

Printed Board Handling and Storage Guidelines

印制板处理和存储指南

Printed Board Handling and Storage Guidelines

印制板操作和储存标准

Printed board handling and storage standards