美利体育登录入口官网:EN 60249-2-19:1993 AMD 2 1995
印刷电路板基材 第2部分:规格 规格编号 19:用于制造多层印刷电路板的具有特定阻燃性的薄型双马来酰亚胺/三嗪改性环氧编织玻璃纤维布覆铜层压板
BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS