共找到 150 条与 Communication Device 相关的标准，共 10 页
Hazardous Materials Management and Hazard Communication
This white paper is to inform users and IEEE 802 working groups on the applications and requirements for low latency communications. Low latency is challenging to implement in wired or wireless networks. Some wireless applications are located in physical environments over which the operator/owner can exert control in unlicensed and licensed spectrum. However, in many environments, devices are subj...
Low-Latency Communication White Paper
This white paper provides a broad overview of potential communication technology and spectrum usage options for unmanned aerial systems (UAS). This paper particularly focuses on the detect and avoid (DAA) or collision avoidance (CA) use case, in line with the vehicle-to-vehicle (V2V) unmanned aerial vehicles (UAV) use case white paper and examines the advantages and disadvantages of state-of-the-a...
V2V UAV Communication Based on Spectrum
This report enumerates PLC Testbed activities undertaken within this working group with the introduction and scope covered in Section 1. Section 2 provides PLC background, presenting the standard landscape, advantages, challenges, and application areas. The three PLC testbed details covering the testbed architecture, experimental set-up, and methodologies used are presented in Section 3. Some of t...
Opportunities for Power Line Communication (PLC) In India: Experiences and Recommendations
IEEE 802 Nendica Report: Flexible Factory IoT: Use Cases and Communication Requirements for Wired and Wireless Bridged Networks
The 3DBP IC Communications, Security and Privacy (CSP) subgroup is investigating the protection of data and records that may contain personal information, and how to ensure users and consumers expectations relative to privacy and security. The subgroup has determined that the requirements from the IEEE draft standards of P7002, P7004, and P7012 can be applied to 3DBP to help ensure security and pr...
IEEE 3D Body Processing Industry Connections (3DBP IC): Communication, Security, and Privacy
本文档由IEEE 3D Body Processing Industry Connections (3DBP IC)编写，旨在调查包含个人信息的3D人体处理数据和记录的保护，以及确保用户和消费者对隐私和安全的期望。文档探讨了将IEEE草案标准P7002、P7004和P7012的要求应用于3D人体处理（3DBP）的方法，以确保安全性和隐私性。此外，文档还评估了欧盟通用数据保护条例（GDPR）的影响，并分析了现有的标准和行业实践，旨在为3D人体处理信息的安全、私密、透明处理建立规范条款。
IEEE 3D Body Processing Industry Connections (3DBP IC)
ISO/IEEE International Standard - Health informatics--Personal health device communication - Part 10419: Device Specialization--Insulin Pump
ISO/IEEE Health informatics ??? Personal health device communication ??? Part 10417: Device specialization ??? Glucose meter
Buerokommunikation; Software-Ergonomie in der Buerokommunikation
Industrielle Kommunikationsnetze - Installation von Kommunikationsnetzen in Industrieanlagen (IEC 65C/853/CD:2016)
Lochstempel mit Kugelsicherung; Schnellwechsel-Lochstempel
