共找到 150 条与 Burn-In 相关的标准，共 10 页
This method is designed to determine the resin content of a prepreg without removing the resin from the reinforcement. The basis weight of the fabric must be known. This method is applicable to both organic and inorganic reinforcements. Note: For referee testing of prepregs with inorganic reinforcement@ Method 2.3.16 shall be used.
Resin Content of Prepreg@ by Burn-Off
This publication is intended as a guideline to develop and establish conditions for burn-in and life test of MIL-PRF-38535 QML integrated circuits. These guidelines are intended to provide manufacturers with a consistent means of defining burn-in and life test stress and electrical test requirements acceptable to user organizations and for the development of Standard Military Drawings. The guidelines cover the entire design, wafer fabrication and manufacturing flows, including design and process awareness. Without design awareness (critical circuit blocks / functionality, etc.), burn-in / life test of an integrated circuit might be compromised, or it might dramatically shorten the device’s life prior to system use.
Selection of Burn-In/Life Test Conditions and Critical Parameters for QML Microcircuits
本测试方法标准第5部分为确定军用操作周围自然元素和条件的有害影响抵抗力的电气测试（数字）建立了统一的测试方法。本标准中的术语“器件”包括单片、多芯片、薄膜和混合微电路、微电路阵列以及构成这些电路和阵列的元件。本标准仅适用于微电子器件。
Test Methods for Microcircuits - Part 5: Test Methods 5000-5999
本部分IEC 62386适用于通过数字信号控制的电子照明美利体育官网首页网址总线系统中的控制装置。该电子照明美利体育官网首页网址应符合IEC 61347的要求，并增加直流电源的要求。
Digital adressierbare Schnittstelle fuer die Beleuchtung - Teil 102: Allgemeine Anforderungen - Betriebsgeraete (IEC 34/420/CDV:2017); Englische Fassung EN 62386-102:2014/prA1:2017
本部分IEC 62386适用于总线系统中通过数字信号控制电子照明美利体育官网首页网址的控制美利体育官网首页网址。该电子照明美利体育官网首页网址应符合IEC 61347的要求，并增加直流电源。
Digital adressierbare Schnittstelle fuer die Beleuchtung - Teil 103: Allgemeine Anforderungen - Steuergeraete (IEC 34/422/CDV:2017); Englische Fassung EN 62386-103:2014/prA1:2017
Delete the second sentence and add, at the end of the first sentence, the following new text: which is in line with the requirements of IEC 61347 (all parts), with the addition of DC supplies.
Digital addressable lighting interface - Part 103: General requirements - Control devices (Endorsed by Asociación Espa?ola de Normalización in December of 2018.)
The scope of this document is to: 1 Specify techniques to detect SC parts using electrical testing. 2 Provide various levels of electrical testing that can be used by the User to define test plans for detecting SC parts. 3 Provide minimum requirements for testing laboratories so that User/Requester can determine which test houses have the necessary capabilities. (For example: technical knowledge, equipment, procedures and protocols for performing electrical testing for verification analysis.) Note: User/Requester is defined in AS6171 General Requirements 4 Specify Burn-In and environmental tests. The environmental tests include Temperature Cycling for Active Devices and Thermal Shock for Passive Devices. Seal Tests are described and recommended for hermetic devices. The following terminology is used throughout this document: a Shall = is mandatory; b Should = is recommended; and c Will = is planned (is considered to be part of a standard process).
Techniques for Suspect/Counterfeit EEE Parts Detection by Electrical Test Methods
。本规范规定了混合微电路、多芯片模块（MCM）及类似器件的一般性能要求，以及确保这些器件满足适用性能要求的验证要求。验证通过使用两个质量程序之一（附录A）来完成。本规范的主体描述了性能要求和获得合格制造商列表（QML）的要求。本规范的附录旨在为制造商制定其验证程序提供指导。详细要求、具体特性及其他对特定预期用途敏感的条款应在适用的器件采购规范中规定。
General Specification for Hybrid Microcircuits
：本试验方法标准第1部分为微电子器件的基本环境试验建立了统一的试验方法，以确定其对军事行动周围自然元素和条件有害影响的抵抗能力。就本标准的目的是，“器件”包括单片、多芯片、薄膜和混合微电路、微电路阵列以及构成电路和阵列的元件。本标准仅适用于微电子器件。
Environmental Test Methods for Microcircuits, Part 1: Test Methods 1000-1999 MIL-STD-883-1 with Change 2
本技术规范涉及用于电信的激光模块的可靠性评估，提供了测试指导、失效判据的使用以及可靠性预测。本技术规范提供以下方面的指导：系统供应商在从激光模块制造商采购激光模块之前应确保实施的测试；系统供应商为验证激光模块制造商的可靠性声明而应执行的一系列活动。
Fibre optic active components and devices. Reliability standards. Laser module degradation
请查看详细信息。
Standard Practice for Manufacturing Characterization of Digital Detector Arrays
This part of IEC 62386 specifies a bus system for control by digital signals of electronic lighting equipment which is in line with the requirements of IEC 61347@ with the addition of DC supplies. This document is only applicable to IEC 62386-103:2014 and IEC 62386103: 2014/AMD1:?? input devices that make the lighting control system sensitive to absolute input devices such as switches or sliders. An absolute input device always has a deterministic state@ such as a position between start and end point. NOTE Requirements for testing individual products during production are not included.
Digital addressable lighting interface - Part 302: Particular requirements - Input devices - Absolute input devices
本测试方法标准的第1部分为微电子器件的基本环境测试建立了统一的测试方法，以确定其对军事行动周围自然元素和条件的有害影响的抵抗能力。本标准中的“器件”包括单片、多芯片、薄膜和混合微电路、微电路阵列以及构成这些电路和阵列的元件。本标准仅适用于微电子器件。
ENVIRONMENTAL TEST METHODS FOR MICROCIRCUITS PART 1: TEST METHODS 1000-1999 For
本国际标准涉及用于电信的激光模块的可靠性评估。本标准的目的是：- 建立评估激光模块可靠性的标准方法，以最大限度地降低风险并促进产品开发和可靠性；- 建立确定随时间分布的故障的方法。这应能够确定指定寿命终了标准的美利体育官网首页网址故障率。此外，还提供了关于以下方面的指导：- 系统供应商在从激光模块制造商采购激光模块之前应确保进行的测试；- 系统供应商为验证激光模块制造商的可靠性声明而应执行的一系列活动。关于基本原理的更多细节见附录 A 和 B。
LASER MODULES USED FOR TELECOMMUNICATION. RELIABILITY ASSESSMENT. (Endorsed by AENOR in June of 1998.)
This part of IEC 60191 gives a glossary of semiconductor sockets for BGA, LGA, FBGA and FLGA. This standard intends to establish definitions and unification of terminology relating to tests and burn-in sockets for BGA, LGA, FBGA and FLGA.
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
