| 标准号 & 类别 | 标准名称 | 发布 |
|---|---|---|
| BS EN 1758:1998 规范 |
Copper and copper alloys - Strip for lead frames
材料状态 |
1998-05-15 英国标准学会 |
| BS EN 60191-6:2009 规范/规程 |
半导体器件的机械标准化.表面安装半导体器件封装外形图绘制的一般规则 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages
|
2010-04-30 英国标准学会 |
| GB/T 14112-1993 TJ |
Semiconductor integrated circuits Specification for stamped leadframes of plastic DIP
半导体集成电路 |
1993-01-21 国家市场监督管理总局 |
| GB/T 14112-2015 试验 |
Semiconductor integrated circuits.Specification for stamped leadframes of plastic DIP
抽样方案 |
2015-05-15 国家市场监督管理总局 |
| GB/T 15876-2015 规范 |
Semiconductor integrated circuits.Specification of leadframes for plastic quad flat package
|
2015-05-15 国家市场监督管理总局 |
| GB/T 15878-2015 规范 |
Semiconductor integrated circuits.Specification of leadframes for small outline package
半导体集成电路 |
2015-05-15 国家市场监督管理总局 |
| GB/T 16525-2015 规范 |
Semiconductor integrated circuits.Specification of leadframes for plastic leaded chip carrier package
|
2015-05-15 国家市场监督管理总局 |
| SJ 51420/1-1996 规范 |
Detail specification of type D ceramic DIP for semiconductor integrated circuits
|
1996-1-1 行业标准-电子 |
| SJ 51420/2-1998 规范 |
Detail specification of Type F ceramic FP for semiconductor integrated circuits
半导体集成电路 |
1998-1-1 行业标准-电子 |
| SJ/T 10515.2-1994 规范 |
Configuration of plastic packaged mould.Cavity configuration
型腔 |
1994-04-11 行业标准-电子 |
| SJ/T 10515.6-1994 规范 |
Configuration of plastic packaged mould.Pre-iocating base
|
1994-04-11 行业标准-电子 |
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