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基于铅的焊接、修复和再制造指南

GUIDANCE FOR LEAD-BASED SOLDERING, REPAIR AND REWORK

制造,组装,拆卸和消毁过程(MADE)的设计.计算机硬件再造和再营销规范

Design for manufacture, assembly, disassembly and end-of-life processing (MADE). Specification for reworking and remarketing of computing hardware

钎焊电子组装件的工艺要求.钎焊电子组装件的再加工、改进和维修

Workmanship requirements for soldered electric assemblies - Rework, modification and repair of soldered electronic assemblies

钎焊电子组件的工艺要求.第5部分:钎焊电子组件的再加工、改进和检修

Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies (IEC 61192-5:2007); German version EN 61192-5:2007

机械连接件的修复与返工

Repair and rework of mechanical connections

电子组装件焊接的返工、改装和返修工艺要求

Rework, modification and rework process requirements for electronic assembly welding

航空电子过程管理 含无铅焊料航空航天及国防电子系统 第23部分：无铅及混装电子产品返工/修复指南

Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solder Part 23: Rework/Repair Guidelines for Lead-Free and Mixed Electronics

焊接电子组件的工艺要求.第5部分:焊接电子组件的再加工、改进和检修

Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies

电子组件的返工、修改和维修

Rework, modification and repair of electronic assemblies

电子组件的返工、 修改和维修

Electronic Component Rework, Modification and Repair

电子组件的返工、修改和维修

Rework, Modification and Repair of Electronic Assemblies

航空电子美利体育官网首页网址的流程管理 含有无铅焊料的航空航天和国防电子系统 返工和维修指南 以解决无铅电子产品和混合组件的影响

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies

印制板返工和返修

Printed board rework and rework