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印制板和其它互连结构用材料.包被和非包被增强基材.规定了易燃性包铜或无铅装配的高性能非卤代环氧编织E型玻璃纤维增强层压板(垂直燃烧试验)

Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-fre

印制板和其它互连结构用材料.包覆和非包覆增强基材.无铅装配用限定燃烧性(垂直燃烧试验)的覆铜溴化环氧纤维素纸/织物E型玻璃增强层压板

Materials for printed boards and other interconnecting structures - Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for le

互连结构用材料.包被和非包被增强基材分规范.包被和非包被增强基材.规定了易燃性的包铜改良溴化环氧编织玻璃纤维增强层压板(垂直燃烧试验)

Materials for interconnection structures - Sectional specification set for reinforced base materials, clad and unclad - Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammab

印制板及其他互连结构用材料 第2-52部分：增强基材（带覆层和不带覆层） 热固性碳氢树脂系统 规定可燃性的E玻璃纤维织物增强层压板

Materials for printed boards and other interconnecting structures - Part 2-52: Reinforced base materials clad and unclad - Thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical…

印制电路板及其他互连结构用材料 增强型基材（带铜和不带铜） 具有规定可燃性（垂直燃烧测试）的未填充PTFE层压板材 覆铜

Materials for printed boards and other interconnecting structures - Reinforced base materials clad and unclad?— PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad

印刷电路板和其他互连结构的材料

Materials for printed boards and other interconnecting structures

印刷电路板和其他互连结构的材料

Materials for printed boards and other interconnecting structures

印刷电路板和其他互连结构的材料

Materials for printed boards and other interconnecting structures

舰船噪声测量方法

Design requirements for printed boards of military electronic equipments

印制板和其它互连结构用材料.第2-30部分:包被和非包被增强基材.规定的易燃性包铜的非卤代环氧改良氰酸酯玻璃纤维层压板(垂直燃烧试验)

Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad

印制板和其它互连结构用材料.第2-39部分:包被和非包被增强基材.无铅组件用规定了易燃性的包铜高性能环氧和非环氧编织E型玻璃纤维增强层压板(垂直燃烧试验)

Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad

印制板和其它互连结构用材料.第2-40部分:包被和非包被增强基材.规定了易燃性的高性能非卤代环氧编织E型玻璃纤维增强层压板(垂直燃烧试验)

Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials, clad and unclad - High performance, non- halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-cl

印制板和其他互连结构用材料. 第2 - 46部分:复合和未复合增强基材. 非卤化环氧化物非织造/机织E -玻璃增强层压板,导热率(1.5w / ( m - K ))和规定的可燃性(垂直燃烧试验),无铅装配用覆铜板

Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1,5 W/(m-K)) and defined flammab

互连结构用材料 第5部分:有或无涂层的导电箔和薄膜分规范集 第1节:铜箔(用于生产覆铜基材)

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)

柔性印制电路板用包铜层压板的试验方法

Test methods of copper-clad laminates for flexible printed wiring boards

柔性印制电路板用包铜层压板(聚酯薄膜、聚酰亚胺薄膜)

Copper-clad laminates for flexible printed wiring boards (Polyester film, Polyimide film)

印制电路板用包铜层压板的通用规则

General rules of copper-clad laminates for printed wiring boards

印制电路板包铜层压板.合成纤维布基、材环氧树脂

Copper-clad laminates for printed wiring boards -- Synthetic fiber fabric base, epoxy resin

印制电路基本材料.规定可燃性的环氧编织E型玻璃纤维叠层板材(立式耐燃性试验)

Base materials for printed circuits -- Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test)

印制电路的基体材料.环氧纤维素纸芯，限定易燃性的(垂直燃烧试验)环氧玻璃布表面包铜层压板

Base materials for printed circuits -- Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)

印制电路基板材料.限定可燃性(垂直燃烧试验)的双马来酰亚胺/三氮杂苯改良环氧衍生物机织玻璃纤维包铜层压片材

Base materials for printed circuits -- Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

印制电路用基体材料.用于多层印制板构成的限定可燃性的薄双马来酰亚胺/三嗪改性的环氧织物玻璃纤维包铜层压板

Base materials for printed circuits -- Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

印制电路板及其他互连件材料 第2-52部分 增强型压合和非压合基材材料 铜压合、热固性烃类树脂体系涂层、E 玻璃纤维增强层

Materials for printed boards and other interconnecting structures - Part 2-52: Reinforced base materials clad and unclad - Thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test),...

印刷电路板及其他连接件材料 第2-53部分 增强型覆铜与非覆铜基材材料 聚四氟乙烯（PTFE）无填充的、具有特定阻燃性（通过垂直燃烧试验测定）的覆铜层压板

Materials for printed boards and other interconnecting structures - Part 2-53: Reinforced base materials clad and unclad - PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad (IEC 61249-2-53:2025)

印刷电路的基础材料 第2部分：规格 规格 9：环氧纤维素纸芯，环氧玻璃布表面覆铜层压板，具有确定的易燃性（垂直燃烧试验）

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION No 9: EPOXIDE CELLULOSE PAPER CORE, EPOXIDE GLASS CLOTH SURFACE COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).

印刷板和其他互连结构用材料 第2-53部分：增强基材材料 有和无涂层 无阻燃填充物的PTFE层压膜（垂直燃烧试验） 涂层为铜……

Materials for printed boards and other interconnecting structures - Part 2-53: Reinforced base materials clad and unclad - Ptfe unfilled laminate sheets of defined flammability (vertical burning test), copper-clad (Endorsed by Asociación Espa?ola de No...

印刷电路板及其他互连结构用材料 第2-53部分：增强型基材（带铜和不带铜） 定义可燃性（垂直燃烧测试）的未填充聚四氟乙烯层压板 带铜箔

Materials for printed boards and other interconnecting structures - Part 2-53: Reinforced base materials clad and unclad - Ptfe unfilled laminate sheets of defined flammability (vertical burning test), copper-clad

印刷电路板和其他互连结构用材料 第2-43部分：增强基材（包覆和非包覆） 具有明确可燃性的非卤化环氧纤维素纸/编织 E 玻璃纤维增强层压板（垂直燃烧试验） co

Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test)@ co

印刷电路板和其他互连结构用材料 第2-44部分：增强基材（包覆和非包覆） 非卤化环氧非织造/编织E玻璃增强层压板（规定可燃性）（垂直燃烧试验） 铜 c

Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test)@ copper-c

印刷电路板和其他互连结构用材料 第2-46部分：增强基材（包覆和非包覆） 热导率为1 5W/(m·K)且可燃性有规定的非卤化环氧无纺布/编织E玻璃增强层压板

Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1@5 W/(m·K) and defined flammabil