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印制板和其它互连结构用材料.非包覆预浸料的分规范集(用于多层板产品).指明易燃的环氧编织E型玻璃纤维预浸料

Materials for printed boards and other interconnecting structures - Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead

印制板和其它互连结构用材料.非包覆预浸料的分规范集(用于多层板产品).阻燃型多功能环氧编织E型玻璃纤维预浸料坯

Materials for printed boards and other interconnecting structures - Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burn

印制板和其它互连结构用材料.无铅装配用规定了燃烧性的无卤环氧化物编织E玻璃纤维预浸料(垂直燃烧法)

Materials for printed boards and other interconnecting structures - Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burn

印制板和其它互连结构用材料. 未包覆预浸料的分规范集 (用于多层板制造). 无铅组件用确定易燃性的环氧化物编织的E玻璃预浸渍材料 (垂直燃烧试验)

Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials unclad (for the manufacture of multilayer boards). High performance epoxide woven E-glass prepreg of defined flammability (vertical burnin

印制板和其它互连结构用材料. 未包覆预浸料的分规范集 (用于多层板制造). 无铅组件用确定易燃性的非卤代环氧化物编织的E玻璃预浸渍材料 (垂直燃烧试验)

Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials unclad (for the manufacture of multilayer boards). High performance non-halogenated epoxide woven E-glass prepreg of defined flammability

铁氧体磁芯 尺寸和表面不规则性限制指南 平面核心

Ferrite cores. Guidelines on dimensions and the limits of surface irregularities - Planar cores

航天产品保证 印刷电路板的资格和采购

Space product assurance - Qualification and Procurement of printed circuit boards; English version EN 16602-70-60:2019, only on CD-ROM / Note: CD-ROM

印刷电路板和其他互连结构用材料 第4-18部分：非包被预浸材料 (多层印制板制造用) 分规格组 无铅组件用确定易燃性的环氧化物编织的E玻璃预浸渍材料 (垂直燃烧试验) （草案）

Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (v

印刷电路板和其他互连结构用材料 第4-19部分：非包被预浸材料 (多层印制板制造用) 分规格组 无铅组件用确定易燃性的非卤代环氧化物编织的E玻璃预浸渍材料 (垂直燃烧试验) （草案）

Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined

印制板和其他互连结构用材料.第4-14部分:非包被预浸料(多层板结构)的分规范集.指定易燃性的无铅化环氧化合物编织E型玻璃预浸料(垂直燃烧试验)

Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning t

印制板和其他互连结构用材料.第4-15部分:非包被预浸料(多层板结构)的分规范集.无铅化装配用指定易燃性多功能环氧化合物编织E型玻璃预浸料(垂直燃烧试验)

Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (ve

印制板和其他互连结构用材料.第4-17部分:非包被预浸料(多层板结构)的分规范集.无铅化装配用指定易燃性多功能环氧化合物编织E型玻璃预浸料(垂直燃烧试验)

Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (ve

器件嵌入组装技术.第2-7部分:指南.无源嵌入电路板的加速应力试验

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

多层板电线电缆交货盘

Multiply wood delivery drums for wires and cables

印刷电路板及其他互连件材料 第4-15部分 用于生产多层板的未浸渍预浸料（neplakiruoti prepreg）特定类型描述汇编 多用途定级阻燃（通过垂直燃烧试验测定）预浸料……

Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability ...

印刷电路板和类似互连件的材质 第4-16部分 用于制造多层板的未覆铜预浸料（ne plakiruot? prepreg?）单种类型描述集 具有特定易燃性的多用途预浸料（通过垂直燃烧试验测定）...

Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defin...

印制电路板及其他互连件的基体材料 第2-18部分 多层板用未浸渍预浸料（非层压）特定规范系列 具有规定阻燃性（垂直燃烧测试法）的高品质预浸料

Materials for printed boards and other interconnecting structures -- Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammabilit...

航天用多层印制电路板试验方法

Test method of multilayer printed board for aeropace

印刷板和其他互连结构的材料 第4-19部分：未包层预浸材料的分规范集

Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Hich performance non-halogenated epoxide woven E-glass prepreg of defi...

印刷电路板的制造 概述和定义列表

Manufacturing of printed circuits boards; survey and list of definitions