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半导体器件.机械和气候试验方法.模剪切强度

Semiconductor devices. Mechanical and climatic test methods. Die shear strength

半导体器件.机械和气候试验方法.第19部分:晶片抗切强度(IEC 60749-19-2003 + A1-2010);德文版本EN 60749-19-2003 + A1-2010

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003 + A1:2010); German version EN 60749-19:2003 + A1:2010

半导体器件 机械和气候测试方法 第19部分：芯片剪切强度

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003 + A1:2010); German version EN 60749-19:2003 + A1:2010 / Note: DIN EN 60749-19 (2003-10) remains valid alongside this standard until 2013-09-01.

半导体芯片产品 第3部分：操作、包装和贮存指南

Semiconductor die products—Part 3: Guide for handling, packing and storage

半导体器件机械和气候测试方法 第19部分：芯片剪切强度（1.0版）

Semiconductor devices Mechanical and climatic test methods Part 19: Die shear strength (Edition 1.0)

半导体器件.机械和气候试验方法.第19部分:模具剪切强度

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

半导体器件.机械和气候试验方法.第19部分:模剪切强度

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test

JEDEC JEP142 指南：用于混合/多芯片模块产品材料获取和接受

JEDEC JEP142 Guideline: Material Acquisition and Acceptance for Hybrid/Multi-Chip Module Products

GT11型半导体硅NPN光敏晶体管详细规范

Detail specification for type GT11 semiconductor sililcon NPN photo-transistor

半导体分立器件.GP和GT级GF 311型半导体黄色发光二极管详细规范

Semiconductor discrete device.Detail specification for semiconductor yellow light emitting diodes for type GF 311 of GP and GT classes